Electronics

Showing 1–15 of 108 results

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    291 FLUX™

    A mildly activated flux for use prior to hot oil fusing. 291 FLUX is formulated without isopropyl alcohol, making it safer to use and store. It is compatible with THERMO FLO® and PRO FUSE Fusing / Leveling fluids. 291 FLUX contains ingredients used in the fusing fluids, which results in reduced consumption and prolongs the life of the fusing fluids.

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    ACTI-FLO™

    A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO is formulated to be compatible with THERMO FLO® and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hardto-fuse areas and is non-foaming.

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    ADC-45N

    A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.

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    ADC™ 40

    A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 40 also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.

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    ADC™47

    A one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC-47 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC-47 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used.

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    ADF™10 BAT

    Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF-10 BAT will generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF-10 BAT contains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.

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    ADF™25

    Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25 breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25 demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.

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    ADF™25C

    A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF-25C breaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF-25C demonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.

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    ADF™30

    A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF30 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.

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    ADF™72

    A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF-72 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life

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    ANTIFOAM BB™

    A blended organic defoaming surfactant for use in reducing foam generated in spray equipment. ANTIFOAM BB is especially effective in solutions used for developing and stripping aqueous and semi-aqueous dry film photoresists. Effective at low temperatures of 80?-130? F.

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    BOARD BRITE™ II

    BOARD BRITE II is an acid cleaner for cleaning and conditioning tin/lead plated board surfaces. It neutralizes ammonia salt residues from alkaline etchants and removes oxides formed during storage. BOARD BRITE II can be used as a pre-cleaner prior to fusing to enhance fusing characteristics. It is effective in both spray and soak applications.

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    CHEMBOND™ 300

    ChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex material and rigid laminate prior to resist lamination. It removes oxidation, light organic soil and the chromate conversion coating. ChemBond 300 forms a surface treatment that resists tarnishing and enhances Resist Stripper, eliminating resist lockon. It will not act as a microetch.

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    ChemBrite™

    ChemBrite™ is a powerful organic solder and tin deoxidizer and brightener. The organic acids in ChemBrite™, combined with other coordinating compounds, give optimum deoxidizing. They are especially important in conditioning printed circuit boards (PCB’s) where the copper etch used is unusually aggressive (which results in a tough oxide film on the solder), or when the solder conditioning time is quite short. Oxides remaining on circuit boards result in a white haze after the board is fused.

    ChemBrite™ is not as corrosive as solder conditioners based on mineral acids, like HCl or HF; this allows a longer lag time between etching and fusing with minimal white haze buildup.

    ChemBrite™ has also been used to clean up tin plating in the lead frame industry, prior to gold plating.

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    Chemposit Sn™

    Chemposit SN™ plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN™ deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit Sn™ Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit Sn™ may be replenished to maintain key ingredients. “”hemposit SN™ plates a dense

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