Innovative Applications

  • Placeholder

    Alkaline Descale™

    Alkaline Descale is a strongly oxidizing surface conditioner designed to descale cobalt/chromium and other chromium based alloys before chemical polishing or electropolishing using CoCr Cleaner (RDZ-1881) or ElectroPolish Ti2 (RDZ-1676), respectively. It will convert insoluble oxides to soluble forms and thus assure uniform subsequent processing. Alkaline Descale is provided in two parts, A and B.

  • Placeholder

    ChemBrite™

    ChemBrite™ is a powerful organic solder and tin deoxidizer and brightener. The organic acids in ChemBrite™, combined with other coordinating compounds, give optimum deoxidizing. They are especially important in conditioning printed circuit boards (PCB’s) where the copper etch used is unusually aggressive (which results in a tough oxide film on the solder), or when the solder conditioning time is quite short. Oxides remaining on circuit boards result in a white haze after the board is fused.

    ChemBrite™ is not as corrosive as solder conditioners based on mineral acids, like HCl or HF; this allows a longer lag time between etching and fusing with minimal white haze buildup.

    ChemBrite™ has also been used to clean up tin plating in the lead frame industry, prior to gold plating.

  • Placeholder

    ChemPolish Ti6Al4V™

    ChemPolish Ti6Al4V is formulated to chemically polish high Ti alloys and produce a surface as brilliant as on an electropolished substrate without the complexity and difficulty associated with electropolishing. ChemPolish Ti6Al4V will remove metal very slowly. If more aggressive metal removal is desired, treat initially with MicroPolish II (RDZ-2059, available from RBP), then treat with ChemPolish Ti6Al4V for final polish.

  • Placeholder

    ChemPolish™ SS

    ChemPolish SS (RDZ-1815) is an acidic bath used for cleaning, polishing and passivating 300 series (austenitic) stainless steel to render it suitable for use in extreme environments such as high vacuum, medical and aerospace applications. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.

  • Placeholder

    Chemposit Sn™

    Chemposit SN™ plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN™ deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit Sn™ Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit Sn™ may be replenished to maintain key ingredients. “”hemposit SN™ plates a dense

  • Placeholder

    ChemStrip™ TL

    ChemStripTM TL is a high speed, stabilized, high capacity tin/lead stripper designed for the stripping of either tips or whole boards. Specifically formulated to provide effective stripping when used in an immersion/soak application, or in automatic tip plating machines. ChemStripTM TL is inhibited against decomposition due to dissolved heavy metals. A full bath life can be expected based on the amount of metal dissolved, not length of time in service. ChemStripTM TL works quickly and effectively without harming the copper substrate and without leaving difficult-to-rinse residues on the boards. A final rinse after stripping leaves boards free of tarnish and ready for further processing.

  • Placeholder

    CoCr Cleaner™

    CoCr Cleaner is an acidic bath used for cleaning and deoxidizing cobalt/chromium alloys to render them suitable for medical and aerospace applications. It removes weld or laser scale leaving a brilliant finish, without hydrogen embrittlement or halide-induced stress cracking. CoCr Cleaner will attack base metal very slowly, and in the process polish the metal. CoCr Cleaner may also be used as a chemical polish for 300 series stainless steel. It is more reactive towards stainless steel than on CoCr.

  • Placeholder

    CuPolish™ Cleaner

    CuPolish Cleaner is a patented cleaner/microetch/adhesion promoter for use on copper. It will give optimal adhesion, both initially and during subsequent processing, where other process chemicals can weaken the bond at the copper interface. CuPolish Cleaner gives an atypical looking surface appearance. The surface after cleaning is bright orange, rather than the more typical matte pink obtained when using other cleaners. Furthermore, after rinsing, the panel will exhibit a water-break that makes it look “worse” than before cleaning. This phenomenon is caused by an adhesion promoter and is normal for this product

  • Placeholder

    De-Ox™ III

    De-Ox™ III is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox™ III deoxidizes without “activating” the metal surface therefore subsequent regrowth of oxides is not altered. De-Ox™ III removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox™ III does not attack plastic surfaces in test sockets.

  • Placeholder

    Defoamer A™

    Defoamer A is a fully organic, non-silicone, water soluble defoamer that rinses readily leaving no residue. It is designed for applications where clean rinsing is essential. Defoamer A is compatible with most strippers and will work over a wide range of pH.

  • Placeholder

    Defoamer FE™

    Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.

  • Placeholder

    Descale Remover™

    Descale Remover removes the manganese dioxide smut as well as other metal oxides solubilized by Alkaline Descale (RDZ-1734), which is available from RBP. Descale Remover is a mixed acid system which uses hydrochloric as the primary acid source. A strong inhibitor system is built-in to insure no metal attack and no hydrogen embrittlement. The inhibitor system will rinse with water and leave no residue on the metal after rinsing that would interfere with subsequent chemical polishing or plating.

  • Placeholder

    ElectroPolish NF™

    ElectroPolish NF is a room temperature electropolish for titanium and titanium alloys. It will polish in minimum time and with minimal metal loss.

  • Placeholder

    ElectroPolish Ti2™

    ElectroPolish Ti2 is a room temperature electropolish for titanium and titanium alloys. It will polish in minimum time and with minimal metal loss.

  • Placeholder

    ElectroPolish™

    ElectroPolish is a room temperature, non-aqueous, methanol based electropolish for titanium and titanium alloys.

  • Placeholder

    Equipment Cleaner II™

    Equipment Cleaner IITM removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner IITM may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner IITM is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue

  • Placeholder

    FlexClean DM™

    FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.

  • Placeholder

    HASL Precleaner SL™

    HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean copper prior to HASL or alternative finishes. It will remove solder mask developer scum, oven baked oxidation and residues, fingerprints, and oils. HASL Precleaner SLTM will not etch copper nor will it damage the. HASL Precleaner SLTM can be used in conjunction with a light microetch or acid cleaner. If an acid cleaner is used, MicroCleanTM ZE is preferred. If a microetch is used, much lower levels of metal removal are fully acceptable, thus minimizing costs and reject rate. Because of the potent cleaning agents that destroy organo-metallic compounds (such as insoluble copper/soldermask compounds) present on the copper surfaces, use of HASL Precleaner SLTM will reduce the requirement for a second pass through the HASL.

  • Placeholder

    MaskStrip™

    MaskStrip™ is designed to remove uncured UV and thermal solder mask from printed circuit boards and screens. MaskStrip™ is fully water rinseable and does not affect laminate or metal plating. With proper dilution, rinse waters may not require special treatment. Screening frames and fabrics will not be harmed with this process.

  • Placeholder

    MicroClean™ BS

    A strong deoxidizer for removing extreme oxides formed by high temperature on Nitinol, and other Titanium alloys. MicroClean™ MV is strongly inhibited from attack on the metal, and will cause negligible metal attack, but usually will clean up essentially any oxide level in a short time (1-5 minutes) and metal loss within this time is minimal

  • Placeholder

    MicroClean™ CuL

    MicroClean CuL is a micro-cleaner” that is designed to remove extremely tenacious soils from copper

  • Placeholder

    MicroClean™ CuLX

    MicroClean CuLX is a micro-cleaner” that is designed to remove extremely tenacious soils from copper

  • Placeholder

    MicroClean™ MV

    MicroClean MV (A+B) is a version of MicroClean MV (RDZ-1995). MicroClean MV (A+B) is supplied as a two part system and offers the same functionality and performance as the original. The benefits of MicroClean MV (A+B) are long shelf life of individual components and increased flexibility in product shipping, storage and handling. MicroClean MV (A+B) is formulated for removing extreme oxides formed at high temperatures on titanium alloys including Nitinol. It is effective at oxide removal within a short contact time with negligible metal attack.

  • Placeholder

    MicroClean™ S

    MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.

  • Placeholder

    MicroClean™ Ti

    Medical components formed from nitinol, other titanium alloys and chrome alloys are often extruded, drawn and oxidized in the formation process, which creates organo-metallic compounds and oxides. These compounds are essentially impossible to remove without etching the metal, and therefore must be destroyed to be removed. MicroClean Ti destroys these organometallic compounds by removing the metal component, yet does not attack the base metal.

  • Placeholder

    MicroClean™ ZE

    MicroClean ZE is a low-foaming cleaner for removing fingerprints as well as chromate and oxide layers from the copper surface prior to photoresist lamination.

  • Placeholder

    MicroPolish™

    MicroPolish and MicroPolish II are two polishes formulated for titanium alloys. Each product acts as a cleaner/deoxidizer and slow chemical polish rapidly removing surface metal oxides but only slowly etching base metals. Of the two polishes, MicroPolish is characterized by a higher etch rate of the base metal. Overall, the etch rates are low for both polishes when compared to traditional deoxidizing chemistries.

  • Placeholder

    MicroPolish™ II

    MicroPolish and MicroPolish II are two polishes formulated for titanium alloys. Each product acts as a cleaner/deoxidizer and slow chemical polish rapidly removing surface metal oxides but only slowly etching base metals. Of the two polishes, MicroPolish II is characterized by a lower etch rate of the base metal. Overall, the etch rates are low for both polishes when compared to traditional deoxidizing chemistries.

  • Placeholder

    Nitinol ElectroPolish™

    Nitinol ElectroPolish is the generic 70% methanol/30% sulfuric acid blend used at lower temperatures to polish Nitinol and other titanium alloys.

  • Placeholder

    PreLam™ Cleaner

    PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.

  • Placeholder

    PreLam™ Cleaner S

    PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.

  • Placeholder

    PreLam™ NF

    PreLam™ NF is a cleaner/microetch for use on copper and other metals prior to photoresist lamination.

  • Placeholder

    ResiStrip™ 5000

    ResiStrip™ 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly and economically. The stripped board is oxidation-free and ready for oxide or etching.

  • Placeholder

    ResiStrip™ MND

    ResiStrip™ MND is designed to completely remove LDI photoresist from Copper and
    Copper based substrates. LDI forms powerful chemical bonds to substrate Copper, and
    requires a formula designed to break these bonds. ResiStrip™ MND is specifically
    formulated to remove photoresist particles that have become lodged in tight mil spaces.
    Removing these particles with conventional photoResist Stripper systems is difficult and
    nearly impossible. ResiStrip™ MND can be used following less expensive stripping
    systems that remove the bulk of the photoresist, without rinsing between strippers.
    ResiStrip™ MND will leave Copper in a bright, tarnish-free condition.

  • Placeholder

    ResiStrip™ VMND

    ResiStrip™ VMND is designed to completely remove LDI photoresist from Copper and
    Copper based substrates. LDI forms powerful chemical bonds to substrate Copper, and
    requires a formula designed to break these bonds. ResiStrip™ VMND is specifically
    formulated to remove photoresist particles that have become lodged in tight mil spaces.
    Removing these particles with conventional photoResist Stripper systems is difficult and
    nearly impossible. Replenishing ResiStrip™ VMND can be done using a special additive,
    ResiStrip™ Maintain (RDZ-2066), instead of the start-up stripper, which cuts
    replenishment costs dramatically, and maintains full stripping performance. ResiStrip™
    VMND leaves Copper in a bright, tarnish-free condition.

  • Placeholder

    Ti Pickling Solution™

    Ti Pickling Solution is formulated for cleaning and deoxidizing titanium and titanium alloys. It is used without or with hydrogen peroxide, which accelerates the cleaning action.

  • Placeholder

    TinPlate™ RT

    TinPlateTM RT plates a dense, smooth Tin deposit onto various copper alloys, gold and
    other less noble metals, leaving a corrosion resistant surface that is highly solderable, even
    when the substrate was not. Since TinPlateTM RT deposits a brilliant finish, subsequent
    reflowing operations may be avoided. Since TinPlateTM RT s a chemical plating (rather
    than an electro-plating”) bath

Mining Chemicals

Chemical Milling

Chemical Polish

Specialty Chemicals