Innovative Applications

Showing 1–15 of 52 results

  • Placeholder

    Alkaline Descale™

    Alkaline Descale is a strongly oxidizing surface conditioner designed to descale cobalt/chromium and other chromium based alloys before chemical polishing or electropolishing using CoCr Cleaner (RDZ-1881) or ElectroPolish Ti2 (RDZ-1676), respectively. It will convert insoluble oxides to soluble forms and thus assure uniform subsequent processing. Alkaline Descale is provided in two parts, A and B.

  • Placeholder

    ChemBrite™

    ChemBrite™ is a powerful organic solder and tin deoxidizer and brightener. The organic acids in ChemBrite™, combined with other coordinating compounds, give optimum deoxidizing. They are especially important in conditioning printed circuit boards (PCB’s) where the copper etch used is unusually aggressive (which results in a tough oxide film on the solder), or when the solder conditioning time is quite short. Oxides remaining on circuit boards result in a white haze after the board is fused.

    ChemBrite™ is not as corrosive as solder conditioners based on mineral acids, like HCl or HF; this allows a longer lag time between etching and fusing with minimal white haze buildup.

    ChemBrite™ has also been used to clean up tin plating in the lead frame industry, prior to gold plating.

  • Placeholder

    ChemPolish Ti6Al4V™

    ChemPolish Ti6Al4V is formulated to chemically polish high Ti alloys and produce a surface as brilliant as on an electropolished substrate without the complexity and difficulty associated with electropolishing. ChemPolish Ti6Al4V will remove metal very slowly. If more aggressive metal removal is desired, treat initially with MicroPolish II (RDZ-2059, available from RBP), then treat with ChemPolish Ti6Al4V for final polish.

  • Placeholder

    ChemPolish™ RD-5

    ChemPolish RD-5 is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish RD-5 leaves a clean finish, free of etching, hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.

  • Placeholder

    ChemPolish™ SS

    ChemPolish SS (RDZ-1815) is an acidic bath used for cleaning, polishing and passivating 300 series (austenitic) stainless steel to render it suitable for use in extreme environments such as high vacuum, medical and aerospace applications. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.

  • Placeholder

    Chemposit Sn™

    Chemposit SN™ plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN™ deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit Sn™ Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit Sn™ may be replenished to maintain key ingredients. “”hemposit SN™ plates a dense

  • Placeholder

    ChemStrip™ TL

    ChemStripTM TL is a high speed, stabilized, high capacity tin/lead stripper designed for the stripping of either tips or whole boards. Specifically formulated to provide effective stripping when used in an immersion/soak application, or in automatic tip plating machines. ChemStripTM TL is inhibited against decomposition due to dissolved heavy metals. A full bath life can be expected based on the amount of metal dissolved, not length of time in service. ChemStripTM TL works quickly and effectively without harming the copper substrate and without leaving difficult-to-rinse residues on the boards. A final rinse after stripping leaves boards free of tarnish and ready for further processing.

  • Placeholder

    CoCr Cleaner™

    CoCr Cleaner is an acidic bath used for cleaning and deoxidizing cobalt/chromium alloys to render them suitable for medical and aerospace applications. It removes weld or laser scale leaving a brilliant finish, without hydrogen embrittlement or halide-induced stress cracking. CoCr Cleaner will attack base metal very slowly, and in the process polish the metal. CoCr Cleaner may also be used as a chemical polish for 300 series stainless steel. It is more reactive towards stainless steel than on CoCr.

  • Placeholder

    CuPolish™ Cleaner

    CuPolish Cleaner is a patented cleaner/microetch/adhesion promoter for use on copper. It will give optimal adhesion, both initially and during subsequent processing, where other process chemicals can weaken the bond at the copper interface. CuPolish Cleaner gives an atypical looking surface appearance. The surface after cleaning is bright orange, rather than the more typical matte pink obtained when using other cleaners. Furthermore, after rinsing, the panel will exhibit a water-break that makes it look “worse” than before cleaning. This phenomenon is caused by an adhesion promoter and is normal for this product

  • Placeholder

    CUPRIC ETCH REPLENISHER™

    CUPRIC ETCH REPLENISHER is used in conjunction with Hydrochloric Acid (Muriatic Acid) to replenish Cupric Chloride etchers. When Copper is etched in Cupric Chloride etchant, Cuprous (Cu+) Copper is created in the etch solution, causing a drastic decrease in etch speed. Regeneration of Cupric Copper (Cu++) with Cupric Etch Replenisher™ will allow continuous, steady etching.
    Additions of CUPRIC ETCH REPLENISHER must be carefully controlled, and added slowly, with intensive mixing, on an as-needed basis only. It is VERY important never to over-add CUPRIC ETCH REPLENISHER to a Cupric Chloride etch solution, as it may result in the generation of Chlorine gas which has been known to be toxic.

  • Placeholder

    De-Ox™

    De-Ox is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox removes only oxides, and will not attack most metals, except zinc and aluminum.

  • Placeholder

    De-Ox™ II

    De-Ox™ II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox™ II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox™ II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox™ II does not attack plastic surfaces in test sockets.

  • Placeholder

    De-Ox™ III

    De-Ox™ III is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox™ III deoxidizes without “activating” the metal surface therefore subsequent regrowth of oxides is not altered. De-Ox™ III removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox™ III does not attack plastic surfaces in test sockets.

  • Placeholder

    Defoamer A™

    Defoamer A is a fully organic, non-silicone, water soluble defoamer that rinses readily leaving no residue. It is designed for applications where clean rinsing is essential. Defoamer A is compatible with most strippers and will work over a wide range of pH.

  • Placeholder

    Defoamer FE™

    Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.

1 2 3 4