Products

Showing 46–60 of 261 results

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    ChemPolish Ti6Al4V™

    ChemPolish Ti6Al4V is formulated to chemically polish high Ti alloys and produce a surface as brilliant as on an electropolished substrate without the complexity and difficulty associated with electropolishing. ChemPolish Ti6Al4V will remove metal very slowly. If more aggressive metal removal is desired, treat initially with MicroPolish II (RDZ-2059, available from RBP), then treat with ChemPolish Ti6Al4V for final polish.

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    ChemPolish™ RD-5

    ChemPolish RD-5 is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish RD-5 leaves a clean finish, free of etching, hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.

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    ChemPolish™ SS

    ChemPolish SS (RDZ-1815) is an acidic bath used for cleaning, polishing and passivating 300 series (austenitic) stainless steel to render it suitable for use in extreme environments such as high vacuum, medical and aerospace applications. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.

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    Chemposit Sn™

    Chemposit SN™ plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN™ deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit Sn™ Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit Sn™ may be replenished to maintain key ingredients. “”hemposit SN™ plates a dense

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    ChemStrip™ TL

    ChemStripTM TL is a high speed, stabilized, high capacity tin/lead stripper designed for the stripping of either tips or whole boards. Specifically formulated to provide effective stripping when used in an immersion/soak application, or in automatic tip plating machines. ChemStripTM TL is inhibited against decomposition due to dissolved heavy metals. A full bath life can be expected based on the amount of metal dissolved, not length of time in service. ChemStripTM TL works quickly and effectively without harming the copper substrate and without leaving difficult-to-rinse residues on the boards. A final rinse after stripping leaves boards free of tarnish and ready for further processing.

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    CHROME ROLLER CLEANER

    A mixture of solvents and desensitizers designed to remove ink and other contaminants from the chrome roller while desensitizing the surface for better water receptivity.

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    CIRCUTEK™ A-778

    An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778 produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.

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    CIRCUTEK™ AC-300

    An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.

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    CIRCUTEK™ C-777

    Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777 is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid. CIRCUTEK PD-776S is also used in the preparation of CIRCUTEK C-777.

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    CIRCUTEK™ CC-710

    An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710 is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC710 is supplied as a liquid concentrate.

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    CIRCUTEK™ CU-825

    A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.

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    CIRCUTEK™ EC-1050

    A room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. CIRCUTEK EC-1050 is easy to control, and has a broad range of operating temperature and bath loading tolerance. The copper produced is a bright pink, fine-grained deposit which is readily receptive to subsequent copper electrodeposition.

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    CIRCUTEK™ PC-701

    A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.

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    CIRCUTEK™ PC-801

    A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.

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    CIRCUTEK™ PD-776

    Pre-dip solution used in conjunction with CIRCUTEK C-777 activator in catalyzing the substrate for subsequent electroless copper deposition. CIRCUTEK PD-776 replaces the hydrochloric acid and water normally used in the step prior to the activator and in the activator solution itself.

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