Visit RBP at IPC APEX EXPO 2018
Date: February 26–March 1, 2018
Location: San Diego Convention Center
RBP Booth: 835
Floor Plan: View Floor Plan
Visit RBP at the IPC APEX EXPO 2018 in February, Booth #835. Also, be sure not to miss two professional development courses presented by RBP’s Mike Carano:
Course Title: PD16: Advanced Printed Circuit Board Trouble Shooting. Getting to the root cause of defects – Part 1
Presentation Date: Monday, February 26
Presentation Time: 9:00 am – 12:00 pm
Course Description: This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent and multiple factors may contribute. This course will explore the most intricate of these factors and how the interrelationship of both up and downstream processes contribute to scrap product. What effect does drilling have on hole wall quality and the subsequent metalization process? Participants will learn how to recognize problems like this and take corrective action. Who Will Benefit: Participants should have some knowledge of the PCB fabrication process. This course will directly benefit those involved in printed circuit board fabrication and assembly. In addition, end users of printed circuit boards, as well as designers will gain significant knowledge about PCB related defects.
Read Full Course Description or Sign-Up
Course Title: PD22: Advanced Printed Circuit Board Trouble Shooting. Getting to the root cause of defects – Part 2
Presentation Date: Monday, February 26
Presentation Time: 2:00 pm – 5:00 pm
Course Description: This course is Part 2 of a two part course, and will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent and multiple factors may contribute. This course will explore the most intricate of these factors and how the interrelationship of both up and downstream processes contribute to scrap product. What effect does drilling have on hole wall quality and the subsequent metalization process? Participants will learn how to recognize problems like this and take corrective action. Who Will Benefit: Participants should have some knowledge of the PCB fabrication process. This course will directly benefit those involved in printed circuit board fabrication and assembly. In addition, end users of printed circuit boards, as well as designers will gain significant knowledge about PCB related defects.
Read Full Course Description or Sign-Up
About IPC APEX EXPO:
In order to succeed in the electronics industry, you have to be in the forefront of technology’s turning point. And that’s exactly what IPC APEX EXPO is—at the center of technology’s turning point. IPC APEX EXPO 2018 is the place to turn inspiration into electronics industry innovation. With its premiere education, technical education, professional development, networking offerings, and the largest collection of industry suppliers, IPC APEX EXPO is the electronics manufacturing industry event of the year.
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