Electronics Chemistry

 
April 2, 2019

IPC Webinar on Technology Trends 2018

Watch Mike Carano, the Vice President of Technology and Business Development at RBP Chemical, discuss technology trends related to PCB fabrication and where the electronics manufacturing industry is headed. You can download the slides from this presentation in PDF format here.

March 12, 2019

Metalization of High Performance Resin Materials with a Graphite-Based Direct Plating System

 Abstract by Michael Carano

August 24, 2018

Working with Flexible Circuits

Flexible circuits were first introduced as a replacement for wire harnesses. The earliest versions date back to World War II. Today, flex and rigid flex circuits are filling an important role across multiple industries, include applications in the medical, automotive, and telecom fields.

August 17, 2018

The importance of surface preparation

Today we are being asked by OEMs, particularly in the high-frequency space, for ways to minimize the amount of surface roughness to provide for enhanced electrical properties. Of course, when you minimize roughness you also run the risk of compromising the optimum adhesion of the smoothed material – especially if you don’t do any surface prep.

July 24, 2018

What can go wrong with lamination? Lots!

A beautifully registered multi-layer board, with nice drilled holes, level copper plating, and no evidence of separation. This is what we strive for in the manufacturing of printed circuit boards.

July 24, 2018

Video: Surface Finishes on Printed Circuit Boards with Mike Carano

What finish should I use for my PCB Design? There’s no one single answer, it depends.

September 22, 2017

Process Engineering and Defect Prevention

September 1, 2017

Video: Highlights of IPC’s PCB Technology Trends 2016 Study

Mike Carano, RBP Vice President of Technology and Business Development leads a webinar to provide an overview of key technical issues driving changes in circuit board design and fabrication, including board thickness and HDI; line width and spaces, via structure and other measurements being driven by the trend toward miniaturization; trends in materials; printed electronics; and today’s biggest technical challenges.

April 19, 2017

Video: Electronics Chemical Reliability Fundamentals for IPC

Reliability Fundamentals: Failure Mechanisms and Success Through Process Modifications

March 22, 2016

Chemical Surface Preparation – The Art of Achieving Fine Lines and Spaces

Michael Carano
RBP Chemical Technology

Article summary

The photoimaging process is one of the first steps in the PCB fabrication process. In order to insure that the image of the circuitry conforms as close to the desired design as possible (i.e. lines and spaces), surface preparation of the copper foil surface is one of the critical success factors. Employing the optimum mix of surface cleaners and microetchants will provide a clean surface with sufficient surface area to promote dry film adhesion. The fabricator has numerous options and should determine the optimum process by accounting for the type of copper foil used as well as the classes of soils to be removed.

Introduction

There are several options available. In addition to pumice and aluminum oxide surface preparation, chemical cleaning as a means to insure optimum photoresist adhesion has gained significant popularity. In this ca