LDI Strip 77 a semi-aqueous photoresist stripper formulated for stripping very fine line and high density printed circuit boards. With properly controlled plating, LDI Strip 77 effectively produces particles 2 mil in diameter and smaller, greatly facilitating filtration. LDI Strip 77 provides complete resist removal with standard Dry Film and LDI Dry film. LDI Strip 77 contains a specially formulated additive package that protects metal surfaces against corrosion, including copper and tin. In addition the LDI 77 Strip enables ease of inspection at outerlayer AOI. LDI Strip 77 can be used in both spray and immersion applications. Working concentration of the LDI Strip 77 will vary based on customer specific processing requirements.
Watch Mike Carano, the Vice President of Technology and Business Development at RBP Chemical, discuss technology trends related to PCB fabrication and where the electronics manufacturing industry is headed. You can download the slides from this presentation in PDF format here.
Abstract by Michael Carano
Flexible circuits were first introduced as a replacement for wire harnesses. The earliest versions date back to World War II. Today, flex and rigid flex circuits are filling an important role across multiple industries, include applications in the medical, automotive, and telecom fields.
Today we are being asked by OEMs, particularly in the high-frequency space, for ways to minimize the amount of surface roughness to provide for enhanced electrical properties. Of course, when you minimize roughness you also run the risk of compromising the optimum adhesion of the smoothed material – especially if you don’t do any surface prep.
A beautifully registered multi-layer board, with nice drilled holes, level copper plating, and no evidence of separation. This is what we strive for in the manufacturing of printed circuit boards.
What finish should I use for my PCB Design? There’s no one single answer, it depends.
Mike Carano, RBP Vice President of Technology and Business Development leads a webinar to provide an overview of key technical issues driving changes in circuit board design and fabrication, including board thickness and HDI; line width and spaces, via structure and other measurements being driven by the trend toward miniaturization; trends in materials; printed electronics; and today’s biggest technical challenges.
Reliability Fundamentals: Failure Mechanisms and Success Through Process Modifications