Electronics Chemistry

March 4, 2020

RBP’s President Featured in New Interview

RBP President, Ernie Litynski, recently sat down for an interview with Dick Crowe of the  “Real Time With…” series while attending this year’s IPC APEX Expo. In the interview Ernie shares his background, his hopes for his new role as RBP’s President and his hopes for the company. Click on the image below to watch.

February 14, 2020

RBP’s Mike Carano Selected as Recipient of Dieter Bergman IPC Fellowship Award

RBP’s Vice President of Business Development and Technology, Mike Carano, was recently selected as a recipient for the Dieter Bergman IPC Fellowship Award at the 2020 IPC APEX EXPO. According to IPC, The Dieter Bergman IPC Fellowship Award is given to those “who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry.”

December 3, 2019

RBP Appoints IEC Exclusive Distributor in North America for PCB Materials

RBP Chemical Technology (RBP), located in Milwaukee, Wisconsin, has named International Electronic Components (IEC) its exclusive distributor for PCB materials in North America.

December 2, 2019

Announcing the Release of MetalTreat Chelate Eliminator-8

RBP Chemical Technology is pleased to introduce another key waste treatment product to serve the metal finishing, electronics and photochemical milling industries. MetalTreat Chelate Eliminator-8 is formulated to eliminate waste of very highly chelated waste streams containing heavy metals.

November 11, 2019

What You Should Know About MAGNUM S-450 Multilayer Hole Conditioner

MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide and is replenishable. MAGNUM S-450 does not require circuit boards to be dried prior to processing.

September 9, 2019

VersaPrep: What To Know About this New Product

 VersaPrep is a specialty formulated product designed to clean and microetch a wide variety of metallic substrates. It is particularly useful in removing metallic oxides and providing a micro-roughened surface to enhance dry film adhesion as well as adhesion of other materials to the surface of the metal. VersaPrep easily deoxidizes and micro-etches copper, copper alloys, stainless steel, aluminum and Inconel.

July 29, 2019

Equipment Cleaner IV: Why Printed Circuit Board Customers Will Be Pleased with this New Product

RBP Chemical Technology is pleased to announce the release of Equipment Cleaner IV. Equipment Cleaner IV removes water hardness residues, photoresist scum and metal salt deposits from chemical processing equipment. The new process is specifically developed for the printed circuit board industry and is very useful for spray equipment. It causes no damage to metal or plastic parts and is completely odorless, making it the ideal process for printed circuit boards.

May 29, 2019

RBP Chemical Technology Announces the Introduction of LDI Strip 77 Fine-Line Photoresist Stripper

LDI Strip 77 a semi-aqueous photoresist stripper formulated for stripping very fine line and high density printed circuit boards.  With properly controlled plating, LDI Strip 77 effectively produces particles 2 mil in diameter and smaller, greatly facilitating filtration.  LDI Strip 77 provides complete resist removal with standard Dry Film and LDI Dry film.  LDI Strip 77 contains a specially formulated additive package that protects metal surfaces against corrosion, including copper and tin. In addition the LDI 77 Strip enables ease of inspection at outerlayer  AOI.  LDI Strip 77 can be used in both spray and immersion applications. Working concentration of the LDI Strip 77 will vary based on customer specific processing requirements.

April 2, 2019

IPC Webinar on Technology Trends 2018

Watch Mike Carano, the Vice President of Technology and Business Development at RBP Chemical, discuss technology trends related to PCB fabrication and where the electronics manufacturing industry is headed. You can download the slides from this presentation in PDF format here.

March 12, 2019

Metalization of High Performance Resin Materials with a Graphite-Based Direct Plating System

 Abstract by Michael Carano

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