RBP Chemical Technology is a leader in developing chemistry for metal finishing.
Browse the table below to learn more about our metal finishing solutions.
|Formance K||Chemical Cleaner||Formance K has been developed to deposit pure, solderable silver layer on copper circuitry in …||electronics-chemicals microetchants copper-cleaning maintenance-cleaning metal-finishing|
|ASPECT||Chemical Cleaner||Organic Solderability Preservative Final Finish for Printed Circuit Boards Aspect is an organic solderability preservative …||electronics-chemicals microetchants copper-cleaning metal-finishing|
|VERSAPREP™||Chemical Cleaner||VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, …||electronics-chemicals cupric-etching microetchants copper-cleaning metal-finishing|
|CuBrite™ PC-520||Carrier Additive||An additive containing the carrier component of the brightener system for CuBrite PC- 525 copper …||electronics-chemicals electrolytic-plating metal-finishing brighteners|
|TinPlate™ PC-625||SEMI-BRIGHT TIN||TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating …||electronics-chemicals electrolytic-plating metal-finishing brighteners tin-lead-chemistry|
|CUBRITE™ CF-110||Matte Acid Copper Plating Agent||A matte acid copper plating additive formulated for plating baths with high throwing power resulting …||electronics-chemicals metal-finishing brighteners|
|CUBRITE™ PC-525||Acidic Copper Brightener||A copper plating additive for acid sulfate plating baths designed specifically for high throwing power …||electronics-chemicals electrolytic-plating metal-finishing brighteners|
|Chemposit Sn™||White Immersion Tin Final Finish||Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant …||electronics-chemicals metal-finishing|