The IPC Education Foundation has established the “Michael Carano Teacher of Excellence Award” to support the professional development for secondary and post-secondary teachers, instructors and educators pursuing training related to the electronics industry. The award includes a $1,000 award prize and a one-year membership pass to IPC EDGE, IPC’s on-line learning platform.
Watch Mike Carano, the Vice President of Technology and Business Development at RBP Chemical, discuss technology trends related to PCB fabrication and where the electronics manufacturing industry is headed. You can download the slides from this presentation in PDF format here.
Abstract by Michael Carano
Practical Tools Inc., a specialized supplier of tools, equipment and supplies to the medical manufacturing and electronics assembly industries, announces that it will welcome RBP Chemical Technology to their booth 2499 at the 2019 MD&M exhibition to take place February 5-7, 2019 at the Anaheim Convention Center, in Anaheim, CA.
Join us at IPC APEX Expo and learn about the new innovations in PCB fabrication chemistry and more.
Newsprint and coldset pressrooms choose Liquid Gold 820 fountain concentrate to maximize the performance of a wide array of plates – including processless. Liquid Gold 820 comes in neutral, mild acid, and hard water versions to meet all users’ water conditions and is formulated with special ingredients to keep the non-image area free of unwanted ink, resulting in sharp, clean print, and quick start ups that reduce paper waste. Like all RBP fountain concentrates, Liquid Gold 820 contains the latest in biocide technology to keep the dampening system clean and free of biological growth.
The Industry’s Best Companies. The Companies’ Best Minds.
Flexible circuits were first introduced as a replacement for wire harnesses. The earliest versions date back to World War II. Today, flex and rigid flex circuits are filling an important role across multiple industries, include applications in the medical, automotive, and telecom fields.
Today we are being asked by OEMs, particularly in the high-frequency space, for ways to minimize the amount of surface roughness to provide for enhanced electrical properties. Of course, when you minimize roughness you also run the risk of compromising the optimum adhesion of the smoothed material – especially if you don’t do any surface prep.
A beautifully registered multi-layer board, with nice drilled holes, level copper plating, and no evidence of separation. This is what we strive for in the manufacturing of printed circuit boards.