Mike Carano, RBP Vice President of Technology and Business Development leads a webinar to provide an overview of key technical issues driving changes in circuit board design and fabrication, including board thickness and HDI; line width and spaces, via structure and other measurements being driven by the trend toward miniaturization; trends in materials; printed electronics; and today’s biggest technical challenges.
The use of processless plates has been gaining traction for some time now. There are several advantages to using these plates. The most advantageous is the elimination of the chemistry used to develop and remove the non-image area of the plate. These chemistries typically have high alkalinity and can be difficult to handle as well as dispose of. By eliminating this step you remove any potential problems with the processor, associated chemistries and plate waste as the processor is completely eliminated.
Reliability Fundamentals: Failure Mechanisms and Success Through Process Modifications
Cave Creek, Arizona July 12, 2016.
March 16, 2016 — The Nominating and Governance Committee of the IPC Board of Directors presented nine candidates for election at the IPC Annual Meeting on March 15, held in conjunction with IPC APEX EXPO 2016 at the Las Vegas Convention Center. Three candidates were elected as Board officers and will serve two-year terms. Three were elected as new Board members and three were selected for term renewal. All six Board members will serve a four-year term.
RBP Chemical Technology
The photoimaging process is one of the first steps in the PCB fabrication process. In order to insure that the image of the circuitry conforms as close to the desired design as possible (i.e. lines and spaces), surface preparation of the copper foil surface is one of the critical success factors. Employing the optimum mix of surface cleaners and microetchants will provide a clean surface with sufficient surface area to promote dry film adhesion. The fabricator has numerous options and should determine the optimum process by accounting for the type of copper foil used as well as the classes of soils to be removed.
With the ever changing plate technology there is always a need for deletion pens in the pressroom. RBP Chemical Technology offers a variety of deletion pens for the newer plate technologies such as the violet and thermal ctp plates. You will find that deletion pens come with different chemistries; they may contain various solvents for removal of image area, water, and an acid to etch the aluminum oxide. Picking the right chemistry for the plate you are using is important. Certain types work better on thermal plates vs. the violet plates. Are the plates baked, are they process less types, or violet? Asking the right questions and finding the right pens can make your job a whole lot easier on press.
From poor print quality, the need for more frequent blanket washes, trouble printing solids and “smashed” blankets – piling is one of the more common challenges in today’s pressroom. In fact, many printers today have come to accept piling as a problem that is inherent to offset printing. However, understanding the causes of piling and implementing quick and effective solutions can go a long way in improving print quality and reducing paper waste and press downtime.