When it comes to electropolishing Nitinol, it’s important to know how to electropolish Nitinol at room temperature compared to electropolishing Nitinol at very low temperatures. Here are some things to keep in mind when electropolishing Nitinol at different temperatures.
Etchback and desmear serve many purposes. The first purpose of etchback is to assure the copper is clean. Assuring the copper is clean will then help form a metallurgical bond with the plating. The last purpose of etchback is to form a three-point contact around the inner layer. Why are each of these processes so important? Below we will go in more depth as to how each process effects the overall goal of etchback.
VersaPrep is a specialty formulated product designed to clean and microetch a wide variety of metallic substrates. It is particularly useful in removing metallic oxides and providing a micro-roughened surface to enhance dry film adhesion as well as adhesion of other materials to the surface of the metal. VersaPrep easily deoxidizes and micro-etches copper, copper alloys, stainless steel, aluminum and Inconel.
Electropolishing is a process used to remove materials from a metallic surface (in this case medical implant devices) to provide a level surface finish. Some of these surfaces including nitinol, cobalt chrome and titanium alloys. Electropolishing allows for less rejection of medical implant devices. Here are at RBP we offer a variety of electropolishes for the medical implant device industry. Here are some of the electropolishes we offer.
The leader in specialty chemicals for industrial applications, RBP Chemical Technology announces the release of a new biodegradable degreaser and release agent.
As a leader in specialty chemicals for the printing industry, we are proud to announce the release of a new state-of-the-art aqueous coating cleaner, AlKalene™ LT. This new product is designed to remove dry ink from press parts in the flexo-packaging industry.
RBP Chemical Technology is pleased to announce the release of Equipment Cleaner IV. Equipment Cleaner IV removes water hardness residues, photoresist scum and metal salt deposits from chemical processing equipment. The new process is specifically developed for the printed circuit board industry and is very useful for spray equipment. It causes no damage to metal or plastic parts and is completely odorless, making it the ideal process for printed circuit boards.
To ensure the effectiveness of medical implant devices it is essential that manufacturers correctly clean, deoxidize, polish and passivate these devices. Here is some relevant background pertaining to these processes.
Brighter, more vibrant colors in coldset printing applications? It’s possible with LIQUID GOLD 290 from RBP Chemical Technology . This mildly acidic fountain concentrate was specifically developed to enhance the color brilliance while fighting blanket buildup and piling – the leading causes of duller print images, ghosting, scumming and ink going where it doesn’t belong.
LDI Strip 77 a semi-aqueous photoresist stripper formulated for stripping very fine line and high density printed circuit boards. With properly controlled plating, LDI Strip 77 effectively produces particles 2 mil in diameter and smaller, greatly facilitating filtration. LDI Strip 77 provides complete resist removal with standard Dry Film and LDI Dry film. LDI Strip 77 contains a specially formulated additive package that protects metal surfaces against corrosion, including copper and tin. In addition the LDI 77 Strip enables ease of inspection at outerlayer AOI. LDI Strip 77 can be used in both spray and immersion applications. Working concentration of the LDI Strip 77 will vary based on customer specific processing requirements.