Today we are being asked by OEMs, particularly in the high-frequency space, for ways to minimize the amount of surface roughness to provide for enhanced electrical properties. Of course, when you minimize roughness you also run the risk of compromising the optimum adhesion of the smoothed material – especially if you don’t do any surface prep.
A beautifully registered multi-layer board, with nice drilled holes, level copper plating, and no evidence of separation. This is what we strive for in the manufacturing of printed circuit boards.
What finish should I use for my PCB Design? There’s no one single answer, it depends.
RBP Chemical Technology, the world-class supplier of proprietary chemicals and delivery devices for the coldset printing industry, is proud to introduce the latest in cleaning technology for pressrooms.
ISO 9001 is a standard that sets out the requirements for a quality management system to enhance customer satisfaction through the effective application of the system, including processes for improvement of the system and the assurance of conformity to customer and applicable statutory and regulatory requirements.
Mike Carano, RBP Vice President of Technology and Business Development leads a webinar to provide an overview of key technical issues driving changes in circuit board design and fabrication, including board thickness and HDI; line width and spaces, via structure and other measurements being driven by the trend toward miniaturization; trends in materials; printed electronics; and today’s biggest technical challenges.
The use of processless plates has been gaining traction for some time now. There are several advantages to using these plates. The most advantageous is the elimination of the chemistry used to develop and remove the non-image area of the plate. These chemistries typically have high alkalinity and can be difficult to handle as well as dispose of. By eliminating this step you remove any potential problems with the processor, associated chemistries and plate waste as the processor is completely eliminated.
Reliability Fundamentals: Failure Mechanisms and Success Through Process Modifications