Printed Circuit Board (PCB) Chemicals

RBP Chemical Technology is a leader in developing chemistry for PCB fabrication and supplying leading electronics manufacturers worldwide.

Browse the table below to learn more about our chemicals for printed circuit board fabrication and other specialized applications.


ProductDescriptionDetails
CuBrite PC-520Carrier AdditiveAn additive containing the carrier component of the brightener system for CuBrite PC- 525 copper …Electronics, Electrolytic Plating, Metal Finishing, Brighteners
Thermo FloLeveling/Fusing FluidA synthetic, water soluble fusing fluid that has been custom blended for tin/lead fusing and …Electronics, Fusing / Leveling
VERSACLEAN™425Chemical CleanerAn acidic blend of surfactants used as an acid soak conditioner to prepare copper surfaces …Electronics, Copper Cleaning
VERSACLEAN™470Acid Soak CleanerAcidic solution used to clean metal surfaces. VersaCLEAN 470 removes metal oxides, light oils and …Electronics, Copper Cleaning
VISUETCH REPLENISHER™Cupric Replenisher RDZ-1339VISUETCH REPLENISHERTM is used in conjunction with Hydrochloric Acid (aka Muriatic Acid) to replenish Cupric …Electronics, Cupric Etching
SODIUM PERSULFATESODIUM PERSULFATESODIUM PERSULFATEElectronics, Microetchants, Copper Cleaning, Outer Layer Processing
SUR CLEAN™ 92Acid Copper Cleaner/MicroetchAn acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic …Electronics, Hot Air Leveling, Microetchants, Copper Cleaning, Inner Layer Processing, Outer Layer Processing
ULTRACLEAN™ NFNon-Foaming Alkaline Spray CleanerFormulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the …Electronics, Adhesion Promotion, Copper Cleaning, Inner Layer Processing, Outer Layer Processing
TinPlate™ PC-625SEMI-BRIGHT TINTinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating …Electronics, Electrolytic Plating, Metal Finishing, Brighteners, Tin / Lead Chemicals
PREPBONDAlkaline Cleaner for Resist Strip ResiduesAn alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete …Electronics, Adhesion Promotion, Copper Cleaning, Inner Layer Processing, Outer Layer Processing
QUANTUM ETCH™Stabilized Hydrogen Peroxide SolutionA stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM …Electronics, Adhesion Promotion, Hot Air Leveling, Microetchants, Copper Cleaning, Inner Layer Processing, Outer Layer Processing
QUENCH AIDE™ 96Fusing Quencher/Rinse AgentFor use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of …Electronics, Hot Air Leveling, Fusing / Leveling
RINSE AIDE™ 90Alkaline Fusing / Leveling Residue RemoverA completely biodegradable concentrate formulated for removing flux residues from printed circuit boards. It effectively …Electronics, Hot Air Leveling, Fusing / Leveling
RINSE AIDE™ 95Alkaline Fusing / Leveling Residue RemoverFormulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling …Electronics, Hot Air Leveling, Fusing / Leveling
ResiStrip™ 5000Alkaline Resist StripperResiStrip™ 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly …Electronics, Resist Stripper
ResiStrip™ MNDHigh Performance Photoresist Stripper RDZ-1403ResiStrip™ MND is designed to completely remove LDI photoresist from Copper and Copper based substrates. …Electronics, Resist Stripper, Outer Layer Processing
ResiStrip™ VMNDVERY High Performance Photoresist Stripper RDZ-2091ResiStrip™ VMND is designed to completely remove LDI photoresist from Copper and Copper based substrates. …Electronics, Resist Stripper
SEMICON RESIST STRIPAqueous Photoresist Stripper ConcentrateA highly concentrated product formulated to remove today’s newest dry film resists in soak or …Electronics, Resist Stripper
SODIUM CHLORATE 46%Liquid Solution for Etch RegenerationLiquid Solution for Etch Regeneration.Electronics, Cupric Etching, Mining Chemicals
POSICLEAN™ MAcid Copper CleanerAn acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™M …Electronics, Copper Cleaning
PreLam™ CleanerPre-Lamination Copper CleanerPreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will …Electronics, Copper Cleaning
PreLam™ Cleaner SPhotoresist Adhesion PromoterPreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will …Electronics, Copper Cleaning
MicroClean™ CuLAlkaline Copper and Iron Alloy Spray CleanerMicroClean CuL is a micro-cleaner” that is designed to remove extremely tenacious soils from copperElectronics, Copper Cleaning, Outer Layer Processing
MicroClean™ CuLXAlkaline Copper and Iron Alloy Soak CleanerMicroClean CuLX is a micro-cleaner” that is designed to remove extremely tenacious soils from copperElectronics, Copper Cleaning, Outer Layer Processing
MicroClean™ ZECopper Cleaner/Oxide and Chromate RemoverMicroClean ZE is a low-foaming cleaner for removing fingerprints as well as chromate and oxide …Electronics, Copper Cleaning
NC ACID CLEANER™Non Chloride Acid Copper CleanerAn acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic …Plate Cleaners, Electronics, Copper Cleaning
MICROSTRIP™ 2000Fine Line Resist StripperA semi-aqueous photoresist stripper for stripping very fine line circuit boards. MICROSTRIP 2000 contains additives …Electronics, Resist Stripper, Outer Layer Processing
Microstrip™ONEFine Line Resist StripperA fully aqueous based resist stripper designed to remove the most tenacious resists. Microstrip™ONE turns …Electronics, Resist Stripper, Outer Layer Processing
MAGNABOND™ CO-300Copper Oxide ProcessA copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from …Electronics, Adhesion Promotion, Copper Cleaning, Inner Layer Processing, Copper Oxide
MAGNABOND™ OxAltOxide Alternative Adhesion PromoterMAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing …Electronics, Adhesion Promotion, Copper Cleaning, Inner Layer Processing, Copper Oxide
ME 515LLiquid Persulfate Copper MicroetchA liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper …Electronics, Hot Air Leveling, Microetchants, Copper Cleaning, Inner Layer Processing, Outer Layer Processing
MAGNUM™ GE-600Glass EtchA non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber …Electronics, Plated Through-Hole (PTH), Electroless
MAGNUM™ K-401 OXIDIZEREtchback/Desmear ProcessA potassium permanganate-based desmear system designed to efficiently remove sensitized resinous material from the hole …Electronics, Plated Through-Hole (PTH), Electroless
MAGNUM™ N-501 OXIDIZEREtchback/Desmear ProcessA sodium permanganate based desmear/etchback system designed to efficiently remove sensitized resinous material from the …Electronics, Plated Through-Hole (PTH), Electroless
MAGNUM™ N-599Neutralizer for Permanganate Desmear ProcessA neutralizer for oxidizer residue left on the hole wall following the permanganate desmear/etchback process. …Electronics, Plated Through-Hole (PTH), Electroless
MAGNUM™ S-400Sensitizer For Multilayer Hole CleaningThe first part of a three step process for multilayer hole preparation. MAGNUM S-400 is …Electronics, Plated Through-Hole (PTH), Electroless
MAGNUM™ S-450 APTH ConditionerMAGNUM S-450 is used to condition holes after drilling and before the desmear step in …Electronics, Plated Through-Hole (PTH), Electroless
LEVELCOTE FLUX 250Horizontal Hot Air Leveling FluxA chloride activated flux for horizontal hot air leveling and tin reflow processes. LEVELCOTE FLUX …Electronics, Fusing / Leveling
LEVELCOTE™ COVER OIL 300Hot Air Leveling Cover OilLEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal …Electronics, Hot Air Leveling, Fusing / Leveling
LEVELCOTE™ FLUX 350Horizontal Hot Air Leveling FluxLEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal …Electronics, Hot Air Leveling, Fusing / Leveling
FlexClean DM™Alkaline Cleaner for Flex CircuitsFlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean …Electronics, Copper Cleaning
HASL Precleaner SL™Hot Air Solder Leveling Precleaner RD-8HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean …Electronics, Copper Cleaning
LAYER CLEAN™ CRAcid Cleaner for Enhanced Chromate RemovalAn acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from …Electronics, Copper Cleaning, Inner Layer Processing, Outer Layer Processing
LAYER CLEAN™ NPPhosphate-Free Acid Cleaner for Enhanced Chromate RemovalAn acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from …Electronics, Copper Cleaning, Inner Layer Processing
FLO RITE™ 60Water Miscible Hot Air Leveling FluxFLO RITE 60 is a unique blend of ingredients for use in a horizontal and …Electronics, Hot Air Leveling, Fusing / Leveling
FLO RITE™ LVLow Viscosity HAL FluxA chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, …Electronics, Hot Air Leveling, Fusing / Leveling
LEVELCOTE COVER OIL 200Hot Air Leveling Cover OilA medium viscosity, non-foaming, water rinseable fluid formulated for covering molten solder in solder pots. …Electronics, Fusing / Leveling
DX™40Aqueous Developer ConcentrateA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
DX™45Developer Replenisher ConcentrateA one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
DX™45 HWAqueous Developer Concentrate for Hard WaterA liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
DX™45 NHAqueous Developer ConcentrateA liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
DX™45 PLUSEnhanced Developer ReplenisherA one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
DUAL STRIP™ BATResist and Ink StripperFormulated to remove fully aqueous dry films and screen ink resists in soak or spray …Electronics, Resist Stripper, Inner Layer Processing
DX™ STRIP BATResist and Ink StripperProvides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. …Electronics, Resist Stripper, Inner Layer Processing, Outer Layer Processing
CuPolish™ CleanerPre-Lamination Copper CleanerCuPolish Cleaner is a patented cleaner/microetch/adhesion promoter for use on copper. It will give optimal …Electronics, Microetchants, Copper Cleaning
D-4000™ LIQUID DEVELOPERAqueous Developer ConcentrateA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous Riston® photopolymer films. D-4000 …Electronics, Developing
CUBRITE™ PC-525Acidic Copper BrightenerA copper plating additive for acid sulfate plating baths designed specifically for high throwing power …Electronics, Electrolytic Plating, Metal Finishing, Brighteners
CUPRIC ETCH REPLENISHER™Cupric Etch ReplenisherCUPRIC ETCH REPLENISHER is used in conjunction with Hydrochloric Acid (Muriatic Acid) to replenish Cupric …Electronics, Cupric Etching
CHEMBOND™ 300One Step Cleaner and Adhesion PromoterChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex …Electronics, Copper Cleaning
CIRCUTEK™ AC-300Liquid Acid CleanerAn acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to …Electronics, Copper Cleaning
CIRCUTEK™ A-778AcceleratorAn acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ C-777Colloidal Palladium ActivatorLow acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ CC-710Alkaline Cleaner/ConditionerAn alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710 …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ CU-825Copper Colloidal CatalystA new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ EC-1050Conventional Speed Electroless Copper ProcessA room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ PC-701High Speed Electroless Copper ProcessA high speed, electroless copper process which is capable of depositing 80 – 100 millionths …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ PC-801High Speed Electroless Copper ProcessA high speed, electroless copper process which is capable of depositing 80 – 100 millionths …Electronics, Plated Through-Hole (PTH), Electroless
CIRCUTEK™ PD-776Liquid Pre-DipPre-dip solution used in conjunction with CIRCUTEK C-777 activator in catalyzing the substrate for subsequent …Electronics, Plated Through-Hole (PTH), Electroless
291 FLUX™Non-Alcohol Activated FluxA mildly activated flux for use prior to hot oil fusing. 291 FLUX is formulated …Electronics, Hot Air Leveling, Fusing / Leveling
ACTI-FLO™Flux for leveling/Fusing FluidsA mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO …Electronics, Fusing / Leveling
ADC-45NAqueous Developer ConcentrateA one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
ADC™ 40Aqueous Developer ConcentrateA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
ADC™47Aqueous Developer ConcentrateA one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC-47 …Electronics, Inner Layer Processing, Outer Layer Processing, Developing
ADF™10 BATSemi Aqueous Resist Stripper With AntitarnishSpecially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF-10 BAT …Electronics, Resist Stripper, Outer Layer Processing
ADF™25Aqueous Photoresist StripperFormulated for outstanding performance on today’s newest dry film resists in spray or soak applications. …Electronics, Resist Stripper, Outer Layer Processing
ADF™25CAqueous Photoresist Stripper ConcentrateA highly concentrated product formulated to remove today’s newest dry film resists in soak or …Electronics, Resist Stripper, Outer Layer Processing
ADF™30Aqueous Resist StripperA photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF30 provides fast …Electronics, Resist Stripper, Outer Layer Processing
ADF™72Aqueous Resist StripperA photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in …Electronics, Resist Stripper, Inner Layer Processing, Outer Layer Processing