Printed Circuit Board (PCB) Chemicals

 

RBP Chemical Technology is a leader in developing chemistry for PCB fabrication and supplying leading electronics manufacturers worldwide.

Browse the table below to learn more about our chemicals for printed circuit board fabrication including through-hole plating chemistry and other specialized applications.


ProductDescriptionDetailsproduct_cat_hfilter
CIRCUTEK™ EC-REDUCERAcceleratorelectronics-chemicals through-hole-plating electroless
RESISTRIP™ CONCENTRATEAcceleratorelectronics-chemicals resist-stripper
DUAL STRIP™ CONCENTRATEAcceleratorelectronics-chemicals resist-stripper inner-layer-processing
ADF-55AcceleratorFormulated to remove fully aqueous dry films and liquid resists in soak or spray applications. …electronics-chemicals resist-stripper outer-layer-processing
CIRCUTEK PC-701AcceleratorA high speed, electroless copper process which is capable of depositing 80 – 100 millionths …electronics-chemicals through-hole-plating electroless
AT-3000AcceleratorAT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and copper alloys. It …copper-cleaning electronics-chemicals
CIRCUTEK™ ME-515AcceleratorA powdered material that is mixed with water and sulfuric acid to make a mild …electronics-chemicals through-hole-plating electroless
Formance K™Chemical CleanerFormance K has been developed to deposit pure, solderable silver layer on copper circuitry in …electronics-chemicals microetchants copper-cleaning maintenance-cleaning metal-finishing
ASPECT™Chemical CleanerOrganic Solderability Preservative Final Finish for Printed Circuit Boards Aspect is an organic solderability preservative …electronics-chemicals microetchants copper-cleaning metal-finishing
VERSAPREP™Chemical CleanerVersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, …electronics-chemicals cupric-etching microetchants copper-cleaning metal-finishing
CuBrite™ PC-520Carrier AdditiveAn additive containing the carrier component of the brightener system for CuBrite PC- 525 copper …electronics-chemicals electrolytic-plating metal-finishing brighteners
Thermo Flo™Leveling/Fusing FluidA synthetic, water soluble fusing fluid that has been custom blended for tin/lead fusing and …electronics-chemicals fusing-leveling
VERSACLEAN™425Chemical CleanerAn acidic blend of surfactants used as an acid soak conditioner to prepare copper surfaces …electronics-chemicals copper-cleaning
VERSACLEAN™470Acid Soak CleanerAcidic solution used to clean metal surfaces. VersaCLEAN 470 removes metal oxides, light oils and …electronics-chemicals copper-cleaning
VISUETCH REPLENISHER™Cupric Replenisher RDZ-1339VISUETCH REPLENISHER is used in conjunction with Hydrochloric Acid (aka Muriatic Acid) to replenish Cupric …electronics-chemicals cupric-etching
SODIUM PERSULFATESODIUM PERSULFATESODIUM PERSULFATEelectronics-chemicals microetchants copper-cleaning outer-layer-processing
SUR CLEAN™ 92Acid Copper Cleaner/MicroetchAn acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic …electronics-chemicals hot-air-leveling microetchants copper-cleaning inner-layer-processing outer-layer-processing
TinPlate™ PC-625SEMI-BRIGHT TINTinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating …electronics-chemicals electrolytic-plating metal-finishing brighteners tin-lead-chemistry
ULTRACLEAN™ NFNon-Foaming Alkaline Spray CleanerFormulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing outer-layer-processing
SEMICON RESIST STRIPAqueous Photoresist Stripper ConcentrateA highly concentrated product formulated to remove today’s newest dry film resists in soak or …electronics-chemicals resist-stripper
SODIUM CHLORATE 46%Liquid Solution for Etch RegenerationLiquid Solution for Etch Regeneration.electronics-chemicals cupric-etching mining-chemicals
PREPBOND™Alkaline Cleaner for Resist Strip ResiduesAn alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing outer-layer-processing
QUANTUM ETCH™Stabilized Hydrogen Peroxide SolutionA stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM …electronics-chemicals adhesion-promotion hot-air-leveling microetchants copper-cleaning inner-layer-processing outer-layer-processing
QUENCH AIDE™ 96Fusing Quencher/Rinse AgentFor use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of …electronics-chemicals hot-air-leveling fusing-leveling
ResiStrip™ 5000Alkaline Resist StripperResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly …electronics-chemicals resist-stripper
ResiStrip™ MNDHigh Performance Photoresist Stripper RDZ-1403ResiStrip MND is designed to completely remove LDI photoresist from Copper and Copper based substrates. …electronics-chemicals resist-stripper outer-layer-processing
ResiStrip™ VMNDVERY High Performance Photoresist Stripper RDZ-2091ResiStrip VMND is designed to completely remove LDI photoresist from Copper and Copper based substrates. …electronics-chemicals resist-stripper
RINSE AIDE™ 90Alkaline Fusing / Leveling Residue RemoverA completely biodegradable concentrate formulated for removing flux residues from printed circuit boards. It effectively …electronics-chemicals hot-air-leveling fusing-leveling
RINSE AIDE™ 95Alkaline Fusing / Leveling Residue RemoverFormulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling …electronics-chemicals hot-air-leveling fusing-leveling
POSICLEAN™ MAcid Copper CleanerAn acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN …electronics-chemicals copper-cleaning
PreLam™ CleanerPre-Lamination Copper CleanerPreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will …electronics-chemicals copper-cleaning
PreLam™ Cleaner SPhotoresist Adhesion PromoterPreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will …electronics-chemicals copper-cleaning
MicroClean™ CuLAlkaline Copper and Iron Alloy Spray CleanerMicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copperelectronics-chemicals copper-cleaning outer-layer-processing
MicroClean™ CuLXAlkaline Copper and Iron Alloy Soak CleanerMicroClean CuLX is a micro-cleaner that is designed to remove extremely tenacious soils from copperelectronics-chemicals copper-cleaning outer-layer-processing
MicroClean™ ZECopper Cleaner/Oxide and Chromate RemoverMicroClean ZE is a low-foaming cleaner for removing fingerprints as well as chromate and oxide …electronics-chemicals copper-cleaning
MICROSTRIP™ 2000Fine Line Resist StripperA semi-aqueous photoresist stripper for stripping very fine line circuit boards. MICROSTRIP 2000 contains additives …electronics-chemicals resist-stripper outer-layer-processing
Microstrip™ONEFine Line Resist StripperA fully aqueous based resist stripper designed to remove the most tenacious resists. Microstrip ONE …electronics-chemicals resist-stripper outer-layer-processing
NC ACID CLEANER™Non Chloride Acid Copper CleanerAn acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic …plate-cleaners electronics-chemicals copper-cleaning pressroom-chemicals
MAGNABOND™ CO-300Copper Oxide ProcessA copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing copper-oxide
MAGNABOND™ OxAltOxide Alternative Adhesion PromoterMAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing copper-oxide
MAGNUM™ GE-600Glass EtchA non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber …electronics-chemicals through-hole-plating electroless
MAGNUM™ K-401 OXIDIZEREtchback/Desmear ProcessA potassium permanganate-based desmear system designed to efficiently remove sensitized resinous material from the hole …electronics-chemicals through-hole-plating electroless
MAGNUM™ N-501 OXIDIZEREtchback/Desmear ProcessA sodium permanganate based desmear/etchback system designed to efficiently remove sensitized resinous material from the …electronics-chemicals through-hole-plating electroless
MAGNUM™ N-599Neutralizer for Permanganate Desmear ProcessA neutralizer for oxidizer residue left on the hole wall following the permanganate desmear/etchback process. …electronics-chemicals through-hole-plating electroless
MAGNUM™ S-400Sensitizer For Multilayer Hole CleaningThe first part of a three step process for multilayer hole preparation. MAGNUM S-400 is …electronics-chemicals through-hole-plating electroless
MAGNUM™ S-450 APTH ConditionerMAGNUM S-450 is used to condition holes after drilling and before the desmear step in …electronics-chemicals through-hole-plating electroless
ME 515LLiquid Persulfate Copper MicroetchA liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper …electronics-chemicals hot-air-leveling microetchants copper-cleaning inner-layer-processing outer-layer-processing
LEVELCOTE™ FLUX 250Horizontal Hot Air Leveling FluxA chloride activated flux for horizontal hot air leveling and tin reflow processes. LEVELCOTE FLUX …electronics-chemicals fusing-leveling
LEVELCOTE™ COVER OIL 300Hot Air Leveling Cover OilLEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal …electronics-chemicals hot-air-leveling fusing-leveling
LEVELCOTE™ FLUX 350Horizontal Hot Air Leveling FluxLEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal …electronics-chemicals hot-air-leveling fusing-leveling
FlexClean DM™Alkaline Cleaner for Flex CircuitsFlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean …electronics-chemicals copper-cleaning
FLO RITE™ 60Water Miscible Hot Air Leveling FluxFLO RITE 60 is a unique blend of ingredients for use in a horizontal and …electronics-chemicals hot-air-leveling fusing-leveling
FLO RITE™ LVLow Viscosity HAL FluxA chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, …electronics-chemicals hot-air-leveling fusing-leveling
HASL Precleaner SL™Hot Air Solder Leveling Precleaner RD-8HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean …electronics-chemicals copper-cleaning
LAYER CLEAN™ CRAcid Cleaner for Enhanced Chromate RemovalAn acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from …electronics-chemicals copper-cleaning inner-layer-processing outer-layer-processing
LAYER CLEAN™ NPPhosphate-Free Acid Cleaner for Enhanced Chromate RemovalAn acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from …electronics-chemicals copper-cleaning inner-layer-processing
LEVELCOTE™ COVER OIL 200Hot Air Leveling Cover OilA medium viscosity, non-foaming, water rinseable fluid formulated for covering molten solder in solder pots. …electronics-chemicals fusing-leveling
DUAL STRIP™ BATResist and Ink StripperFormulated to remove fully aqueous dry films and screen ink resists in soak or spray …electronics-chemicals resist-stripper inner-layer-processing
DX™ STRIP BATResist and Ink StripperProvides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. …electronics-chemicals resist-stripper inner-layer-processing outer-layer-processing
DX™40Aqueous Developer ConcentrateA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45Developer Replenisher ConcentrateA one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45 HWAqueous Developer Concentrate for Hard WaterA liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45 NHAqueous Developer ConcentrateA liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45 PLUSEnhanced Developer ReplenisherA one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. …electronics-chemicals inner-layer-processing outer-layer-processing developing
CUBRITE™ PC-525Acidic Copper BrightenerA copper plating additive for acid sulfate plating baths designed specifically for high throwing power …electronics-chemicals electrolytic-plating metal-finishing brighteners
CuPolish™ CleanerPre-Lamination Copper CleanerCuPolish Cleaner is a patented cleaner/microetch/adhesion promoter for use on copper. It will give optimal …electronics-chemicals microetchants copper-cleaning
CUPRIC ETCH REPLENISHER™Cupric Etch ReplenisherCUPRIC ETCH REPLENISHER is used in conjunction with Hydrochloric Acid (Muriatic Acid) to replenish Cupric …electronics-chemicals cupric-etching
D-4000™ LIQUID DEVELOPERAqueous Developer ConcentrateA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous Riston® photopolymer films. D-4000 …electronics-chemicals developing
CHEMBOND™ 300One Step Cleaner and Adhesion PromoterChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex …electronics-chemicals copper-cleaning
CIRCUTEK™ A-778AcceleratorAn acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ AC-300Liquid Acid CleanerAn acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to …electronics-chemicals copper-cleaning
CIRCUTEK™ C-777Colloidal Palladium ActivatorLow acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ CC-710Alkaline Cleaner/ConditionerAn alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710 …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ CU-825Copper Colloidal CatalystA new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ EC-1050Conventional Speed Electroless Copper ProcessA room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ PC-701High Speed Electroless Copper ProcessA high speed, electroless copper process which is capable of depositing 80 – 100 millionths …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ PC-801High Speed Electroless Copper ProcessA high speed, electroless copper process which is capable of depositing 80 – 100 millionths …electronics-chemicals through-hole-plating electroless
CIRCUTEK™ PD-776Liquid Pre-DipPre-dip solution used in conjunction with CIRCUTEK C-777 activator in catalyzing the substrate for subsequent …electronics-chemicals through-hole-plating electroless
291 FLUX™Non-Alcohol Activated FluxA mildly activated flux for use prior to hot oil fusing. 291 FLUX is formulated …electronics-chemicals hot-air-leveling fusing-leveling
ACTI-FLO™Flux for leveling/Fusing FluidsA mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO …electronics-chemicals fusing-leveling
ADC-45NAqueous Developer ConcentrateA one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It …electronics-chemicals inner-layer-processing outer-layer-processing developing
ADC™ 40Aqueous Developer ConcentrateA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It …electronics-chemicals inner-layer-processing outer-layer-processing developing
ADC™47Aqueous Developer ConcentrateA one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC …electronics-chemicals inner-layer-processing outer-layer-processing developing
ADF™10 BATSemi Aqueous Resist Stripper With AntitarnishSpecially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF 10 …electronics-chemicals resist-stripper outer-layer-processing
ADF™25Aqueous Photoresist StripperFormulated for outstanding performance on today’s newest dry film resists in spray or soak applications. …electronics-chemicals resist-stripper outer-layer-processing
ADF™25CAqueous Photoresist Stripper ConcentrateA highly concentrated product formulated to remove today’s newest dry film resists in soak or …electronics-chemicals resist-stripper outer-layer-processing
ADF™30Aqueous Resist StripperA photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF 30 provides …electronics-chemicals resist-stripper outer-layer-processing
ADF™72Aqueous Resist StripperA photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in …electronics-chemicals resist-stripper inner-layer-processing outer-layer-processing