Printed Circuit Board (PCB) Chemicals

 

RBP Chemical Technology is a leader in developing chemistry for PCB fabrication and supplying leading electronics manufacturers worldwide.

Browse the table below to learn more about our chemicals for printed circuit board fabrication including through-hole plating chemistry and other specialized applications.


ProductDetailsproduct_cat_hfilter
LDI Strip 77LDI Strip 77 is a semi-aqueous photoresist stripper formulated for stripping very fine line circuit …electronics-chemicals resist-stripper
OnyxGraphite Based Direct Metallization for Printed Circuit Boards. Onyx is a process in which a …printed-circuit-board-fabrication-chemicals through-hole-plating copper-cleaning electronics-chemicals
CIRCUTEK™ EC-REDUCERReducing Agent Additive for Electroless Copperelectronics-chemicals through-hole-plating electroless
RESISTRIP™ CONCENTRATEHigh Speed Dry Film Photoresist Stripper for Industrial Use Onlyelectronics-chemicals resist-stripper
DUAL STRIP™ CONCENTRATEAdditive for pH Controlelectronics-chemicals resist-stripper inner-layer-processing
ADF-55Formulated to remove fully aqueous dry films and liquid resists in soak or spray applications. …electronics-chemicals resist-stripper outer-layer-processing
CIRCUTEK PC-701A high speed, electroless copper process which is capable of depositing 80 – 100 millionths …electronics-chemicals through-hole-plating electroless
AT-3000AT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and copper alloys. It …copper-cleaning electronics-chemicals
CIRCUTEK™ ME-515A powdered material that is mixed with water and sulfuric acid to make a mild …electronics-chemicals through-hole-plating electroless
Formance K™Formance K has been developed to deposit pure, solderable silver layer on copper circuitry in …electronics-chemicals microetchants copper-cleaning maintenance-cleaning metal-finishing
ASPECT™Organic Solderability Preservative Final Finish for Printed Circuit Boards Aspect is an organic solderability preservative …electronics-chemicals microetchants copper-cleaning metal-finishing
VERSAPREP™VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, …electronics-chemicals cupric-etching microetchants copper-cleaning metal-finishing
CuBrite™ PC-520An additive containing the carrier component of the brightener system for CuBrite PC- 525 copper …electronics-chemicals electrolytic-plating metal-finishing brighteners
Thermo Flo™A synthetic, water soluble fusing fluid that has been custom blended for tin/lead fusing and …electronics-chemicals fusing-leveling
VERSACLEAN™425An acidic blend of surfactants used as an acid soak conditioner to prepare copper surfaces …electronics-chemicals copper-cleaning
VERSACLEAN™470Acidic solution used to clean metal surfaces. VersaCLEAN 470 removes metal oxides, light oils and …electronics-chemicals copper-cleaning
VISUETCH REPLENISHER™VISUETCH REPLENISHER is used in conjunction with Hydrochloric Acid (aka Muriatic Acid) to replenish Cupric …electronics-chemicals cupric-etching
SODIUM PERSULFATESODIUM PERSULFATEelectronics-chemicals microetchants copper-cleaning outer-layer-processing
SUR CLEAN™ 92An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic …electronics-chemicals hot-air-leveling microetchants copper-cleaning inner-layer-processing outer-layer-processing
TinPlate™ PC-625TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating …electronics-chemicals electrolytic-plating metal-finishing brighteners tin-lead-chemistry
ULTRACLEAN™ NFFormulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing outer-layer-processing
SEMICON RESIST STRIPA highly concentrated product formulated to remove today’s newest dry film resists in soak or …electronics-chemicals resist-stripper
SODIUM CHLORATE 46%Liquid Solution for Etch Regeneration.electronics-chemicals cupric-etching mining-chemicals
PREPBOND™An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing outer-layer-processing
QUANTUM ETCH™A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM …electronics-chemicals adhesion-promotion hot-air-leveling microetchants copper-cleaning inner-layer-processing outer-layer-processing
QUENCH AIDE™ 96For use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of …electronics-chemicals hot-air-leveling fusing-leveling
ResiStrip™ 5000ResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly …electronics-chemicals resist-stripper
ResiStrip™ MNDResiStrip MND is designed to completely remove LDI photoresist from Copper and Copper based substrates. …electronics-chemicals resist-stripper outer-layer-processing
ResiStrip™ VMNDResiStrip VMND is designed to completely remove LDI photoresist from Copper and Copper based substrates. …electronics-chemicals resist-stripper
RINSE AIDE™ 90A completely biodegradable concentrate formulated for removing flux residues from printed circuit boards. It effectively …electronics-chemicals hot-air-leveling fusing-leveling
RINSE AIDE™ 95Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling …electronics-chemicals hot-air-leveling fusing-leveling
POSICLEAN™ MAn acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN …electronics-chemicals copper-cleaning
PreLam™ CleanerPreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will …electronics-chemicals copper-cleaning
PreLam™ Cleaner SPreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will …electronics-chemicals copper-cleaning
MicroClean™ CuLMicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copperelectronics-chemicals copper-cleaning outer-layer-processing
MicroClean™ CuLXMicroClean CuLX is a micro-cleaner that is designed to remove extremely tenacious soils from copperelectronics-chemicals copper-cleaning outer-layer-processing
MicroClean™ ZEMicroClean ZE is a low-foaming cleaner for removing fingerprints as well as chromate and oxide …electronics-chemicals copper-cleaning
MICROSTRIP™ 2000A semi-aqueous photoresist stripper for stripping very fine line circuit boards. MICROSTRIP 2000 contains additives …electronics-chemicals resist-stripper outer-layer-processing
Microstrip™ONEA fully aqueous based resist stripper designed to remove the most tenacious resists. Microstrip ONE …electronics-chemicals resist-stripper outer-layer-processing
NC ACID CLEANER™An acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic …plate-cleaners electronics-chemicals copper-cleaning pressroom-chemicals
MAGNABOND™ CO-300A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing copper-oxide
MAGNABOND™ OxAltMAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing …electronics-chemicals adhesion-promotion copper-cleaning inner-layer-processing copper-oxide
MAGNUM™ GE-600A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber …electronics-chemicals through-hole-plating electroless
MAGNUM™ K-401 OXIDIZERA potassium permanganate-based desmear system designed to efficiently remove sensitized resinous material from the hole …electronics-chemicals through-hole-plating electroless
MAGNUM™ N-501 OXIDIZERA sodium permanganate based desmear/etchback system designed to efficiently remove sensitized resinous material from the …electronics-chemicals through-hole-plating electroless
MAGNUM™ N-599A neutralizer for oxidizer residue left on the hole wall following the permanganate desmear/etchback process. …electronics-chemicals through-hole-plating electroless
MAGNUM™ S-400The first part of a three step process for multilayer hole preparation. MAGNUM S-400 is …electronics-chemicals through-hole-plating electroless
MAGNUM™ S-450 AMAGNUM S-450 is used to condition holes after drilling and before the desmear step in …electronics-chemicals through-hole-plating electroless
ME 515LA liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper …electronics-chemicals hot-air-leveling microetchants copper-cleaning inner-layer-processing outer-layer-processing
LEVELCOTE™ FLUX 250A chloride activated flux for horizontal hot air leveling and tin reflow processes. LEVELCOTE FLUX …electronics-chemicals fusing-leveling
LEVELCOTE™ COVER OIL 300LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal …electronics-chemicals hot-air-leveling fusing-leveling
LEVELCOTE™ FLUX 350LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal …electronics-chemicals hot-air-leveling fusing-leveling
FlexClean DM™FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean …electronics-chemicals copper-cleaning
FLO RITE™ 60FLO RITE 60 is a unique blend of ingredients for use in a horizontal and …electronics-chemicals hot-air-leveling fusing-leveling
FLO RITE™ LVA chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, …electronics-chemicals hot-air-leveling fusing-leveling
HASL Precleaner SL™HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean …electronics-chemicals copper-cleaning
LAYER CLEAN™ CRAn acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from …electronics-chemicals copper-cleaning inner-layer-processing outer-layer-processing
LAYER CLEAN™ NPAn acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from …electronics-chemicals copper-cleaning inner-layer-processing
LEVELCOTE™ COVER OIL 200A medium viscosity, non-foaming, water rinseable fluid formulated for covering molten solder in solder pots. …electronics-chemicals fusing-leveling
DUAL STRIP™ BATFormulated to remove fully aqueous dry films and screen ink resists in soak or spray …electronics-chemicals resist-stripper inner-layer-processing
DX™ STRIP BATProvides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. …electronics-chemicals resist-stripper inner-layer-processing outer-layer-processing
DX™40A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45 HWA liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45 NHA liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and …electronics-chemicals inner-layer-processing outer-layer-processing developing
DX™45 PLUSA one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. …electronics-chemicals inner-layer-processing outer-layer-processing developing
CUBRITE™ PC-525A copper plating additive for acid sulfate plating baths designed specifically for high throwing power …electronics-chemicals electrolytic-plating metal-finishing brighteners
D-4000™ LIQUID DEVELOPERA one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous Riston® photopolymer films. D-4000 …electronics-chemicals developing