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ACIDIFIED PUMICEis a uniform blend of fine pumice and citric acid, ideally suited for micro-roughening copper surfaces prior to dry film and/or LPI solder mask. The particle distribution of ACIDIFIED PUMICEwas selected based upon efficiently processing difficult features, particularly mechanical plugging of high aspect ratio through holes.
RBP?s COPPER SULFATE SOLUTIONis manufactured using only sulfuric acid and pure copper metal. No recycled copper is ever used. This produces a high purity material, which is low in both organic and inorganic impurities. It is intended for the make up and replenishment of acid copper plating solutions, but its high purity also allows it to be used for the make up and replenishment of printed circuit board plating solutions. No purification or filtration is required before use.
Ferric Chloride Solution is acidic and should be handled only with appropriate safety equipment including goggles, gloves and protective clothing. Follow standard laboratory practices. Consult Safety Data Sheet for further information. Used solutions contain metal ions and may require treatment before spent solutions are disposed. Dispose of in accordance with federal, state and local regulations. Contact your RBP representative for further information.Clear to slightly hazy, dark red-brown liquid with a sharp odor.