Copper Oxide

 

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    MAGNABOND™ CO-300

    A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.

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    MAGNABOND™ OxAlt

    MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing the topography of the copper substrate. MAGNABOND OxAlt offers several benefits over other conventional oxide and competitive oxide alternatives, including: low cost of operation; ease of control, and consistent copper topography at etch rates of 40 microinches per minute. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the MAGNABOND OxAlt.