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FLO RITE 60 is a unique blend of ingredients for use in a horizontal and vertical hot air leveling process. FLO RITE 60 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. FLO RITE 60 will provide a bright uniform finish with good rinsability. FLO RITE 60 is a solvent free, non-foaming flux that is compatible with LPI and dry film soldermasks.
A chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, where a lower viscosity flux is desired for complete wetting of small holes and surface mount pads. FLO RITE LV provides excellent wetting and even coverage, resulting in a superior solder finish.
A medium viscosity, non-foaming, water rinseable fluid formulated for covering molten
solder in solder pots. LEVELCOTE COVER OIL 200 eliminates oxides on the solder
surface during leveling operations. It can also be used as a Fusing / Leveling fluid.
LEVELCOTE COVER OIL 200 can replace petroleum oils used for fusing tin plating on
metals (brass, zinc diecast, copper, steel).
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.
A chloride activated flux for horizontal hot air leveling and tin reflow processes.
LEVELCOTE FLUX 250 is designed for maximum performance in horizontal hot air
leveling systems, or where a lower viscosity flux is needed for complete wetting of small
holes and surface mount pads. It provides excellent wetting and even coverage, resulting in
a superior solder finish. LEVELCOTE FLUX 250 can be used in metal finishing
applications with LEVELCOTE COVER OIL 200 for fusing tin plated on metals (brass,
zinc diecast, copper, steel).
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
For use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of the panels at a steady rate, preventing thermal shock and maintaining a bright, even solder appearance. It is non-foaming and rinses easily with water.
A completely biodegradable concentrate formulated for removing flux residues from printed circuit boards. It effectively removes both ionic and non-ionic surfactants left on fused boards. It also removes processing residues on SMOBC boards when used prior to solder mask application. RINSE AIDE 90 is effective in soak and spray applications.
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
A synthetic, water soluble fusing fluid that has been custom blended for tin/lead fusing and
leveling. Additives for greater thermal stability increase the bath life and reduce smoking.
THERMO FLO maintains a high level of performance, providing an excellent surface
finish with complete edge coverage throughout its bath life