Inner Layer Processing

 

Showing all 17 results

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    DUAL STRIP™ BAT

    Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications. DUAL STRIP will generally break dry films into particles suitable for filtration. DUAL STRIP has a low VOC content for reduced air emissions. DUAL STRIP BAT contains additional copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.

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    DUAL STRIP™ CONCENTRATE

    Additive for pH Control

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    DX™ STRIP BAT

    Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.

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    DX™40

    A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It contains a unique blend of ingredients to enhance the loading capacity of the solution and help keep the equipment clean. These special ingredients help ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These features result in greater productivity and less down time. DX-40 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used. “” one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle

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    DX™45

    A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45’s highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photore”

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    DX™45 HW

    A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore

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    DX™45 NH

    A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 NH contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These same ingredients help keep the equipment clean

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    DX™45 PLUS

    A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”

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    LAYER CLEAN™ CR

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    LAYER CLEAN™ NP

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    MAGNABOND™ CO-300

    A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.

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    MAGNABOND™ OxAlt

    MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing the topography of the copper substrate. MAGNABOND OxAlt offers several benefits over other conventional oxide and competitive oxide alternatives, including: low cost of operation; ease of control, and consistent copper topography at etch rates of 40 microinches per minute. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the MAGNABOND OxAlt.

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    ME 515L

    A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.

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    PREPBOND™

    An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch. It completely removes residues from Resist Stripper, and is extremely effective for removing handling soils and fingerprints. For spray, flood and soak applications.

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    QUANTUM ETCH™

    A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM ETCH provides a superior microetch which can be used for inner layer processing, pre-plate cleaning, and cleaning prior to solder leveling. For pre-plate cleaning of panels plated with electroless copper, use the low etch rate operating conditions. QUANTUM ETCH produces a uniformly etched surface, and will maintain a constant desired etch rate over a broad solubility range of copper sulfate in the bath.

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    SUR CLEAN™ 92

    An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.

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    ULTRACLEAN™ NF

    Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the copper. ULTRACLEAN NF is especially recommended for cleaning Invar/copper laminate and double treated copper foil. Also for use prior to resist lamination, oxide treatment and plating processes. Its non-chelating formula allows for easy waste treatment. ULTRACLEAN NF is non-foaming for use in conveyorized spray applications.