Metal Finishing


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    Organic Solderability Preservative Final Finish for Printed Circuit Boards. Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface mount technology. It can be used for mixed final finish, ENIG/OSP applications.

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    CuBrite™ PC-520

    An additive containing the carrier component of the brightener system for CuBrite PC-
    525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
    excessive additions of brightener to maintain desired characteristics of the plated copper
    deposit. It can be used after carbon treatment of the plating bath, or whenever there is
    excessive drag-out of the plating solution.

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    CUBRITE™ PC-525

    A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.

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    Formance K™

    Immersion Silver Final Finish for Printed Circuit Boards. Formance K has been developed to deposit pure, solderable silver layer on copper circuitry in compliance with IPC specification no. IPC-4553A. The deposit satisfies Class 3 final finish durability and is an excellent choice for demanding Pb-free assembly. Formance K is an easy to use product with simple analytical controls and straightforward replenishment that leads to lower running cost. Notably, the chemistry is EDTA- and alkylphenol ethoxylate-free and thus biodegradable.

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    TinPlate™ PC-625

    TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating of tin in
    the application for SMOBC fabrication. TinPlate PC-625 is formulated to improve the
    throwing power of the bath, aid in refining grain structure, and prevent treeing. It is added
    based on amp hours and will increase limiting current density and control deposit
    characteristics over a wide range of current densities. It produces a bright silver white
    deposit. TinPlate PC-625 eliminates the need for lead and fluoborates used in
    conventional etch resist plating processes. If an extra wetting agent is needed,
    use TinPlate PC-625 Starter. Please consult your service representative for additions.

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    VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, imaging and solder mask application. Microetching results in surfaces that are cleaner, with removed or reduced oxide and with higher roughness. These mechanisms occur to a different extent on different metals. VersaPrep is effective on aluminum, stainless steel, copper, copper alloys and selected other alloys such as Inconel. Different substrates can be treated with simple adjustments of concentration, temperature and contact time. VersaPrep can be used in either spray or soak mode.