Outer Layer Processing

 

Showing all 19 results

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    ADF-55

    Formulated to remove fully aqueous dry films and liquid resists in soak or spray
    applications. ADF-55 breaks dry films into particles suitable for filtration and has a low
    VOC content for reduced air emissions. ADF-55 contains special copper brightening and
    antitarnish agents that produce a bright, uniform copper surface for automatic optical
    inspection and better etching characteristics.

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    DX™ STRIP BAT

    Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.

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    DX™40

    A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It contains a unique blend of ingredients to enhance the loading capacity of the solution and help keep the equipment clean. These special ingredients help ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These features result in greater productivity and less down time. DX-40 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used. “” one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle

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    DX™45

    A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45’s highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photore”

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    DX™45 HW

    A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore

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    DX™45 NH

    A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 NH contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These same ingredients help keep the equipment clean

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    DX™45 PLUS

    A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”

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    LAYER CLEAN™ CR

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    ME 515L

    A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.

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    MicroClean™ CuL

    MicroClean CuL is a micro-cleaner” that is designed to remove extremely tenacious soils from copper

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    MicroClean™ CuLX

    MicroClean CuLX is a micro-cleaner” that is designed to remove extremely tenacious soils from copper

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    MICROSTRIP™ 2000

    A semi-aqueous photoresist stripper for stripping very fine line circuit boards. MICROSTRIP 2000 contains additives that increase penetration into small lines and spaces, significantly improving removal. It provides fast strip speeds and contains copper brightening and antitarnish agents which produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics. For use in spray and soak applications.

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    Microstrip™ONE

    A fully aqueous based resist stripper designed to remove the most tenacious resists. Microstrip ONE turns resist into fine particles to ensure the complete removal of it from extremely narrow line spacing (<4 mils) and from underneath over-plated areas. Microstrip ONE contains copper anti-tarnish agents for better etching characteristics.

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    PREPBOND™

    An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch. It completely removes residues from Resist Stripper, and is extremely effective for removing handling soils and fingerprints. For spray, flood and soak applications.

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    QUANTUM ETCH™

    A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM ETCH provides a superior microetch which can be used for inner layer processing, pre-plate cleaning, and cleaning prior to solder leveling. For pre-plate cleaning of panels plated with electroless copper, use the low etch rate operating conditions. QUANTUM ETCH produces a uniformly etched surface, and will maintain a constant desired etch rate over a broad solubility range of copper sulfate in the bath.

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    ResiStrip™ MND

    ResiStrip MND is designed to completely remove LDI photoresist from Copper and
    Copper based substrates. LDI forms powerful chemical bonds to substrate Copper, and
    requires a formula designed to break these bonds. ResiStrip MND is specifically
    formulated to remove photoresist particles that have become lodged in tight mil spaces.
    Removing these particles with conventional photoResist Stripper systems is difficult and
    nearly impossible. ResiStrip MND can be used following less expensive stripping
    systems that remove the bulk of the photoresist, without rinsing between strippers.
    ResiStrip MND will leave Copper in a bright, tarnish-free condition.

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    SODIUM PERSULFATE

    SODIUM PERSULFATE

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    SUR CLEAN™ 92

    An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.

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    ULTRACLEAN™ NF

    Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the copper. ULTRACLEAN NF is especially recommended for cleaning Invar/copper laminate and double treated copper foil. Also for use prior to resist lamination, oxide treatment and plating processes. Its non-chelating formula allows for easy waste treatment. ULTRACLEAN NF is non-foaming for use in conveyorized spray applications.