Showing all 10 results
A high speed, electroless copper process which is capable of depositing 80 – 100 millionths
of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on
catalyzed surfaces for the production of printed circuit boards.
The solution is easy to control and has a broad operating temperature range. The copper
produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent
A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards.
A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber bundles left exposed after the permanganate etchback process. It can be mixed with MAGNUM N-599 NEUTRALIZER or used as a separate step for maximum process control.
A potassium permanganate-based desmear system designed to efficiently remove sensitized resinous material from the hole wall of printed circuit boards. MAGNUM K-401 OXIDIZER produces a microporous surface topography to improve catalyst absorption and hole wall adhesion of electroless copper.
A sodium permanganate based desmear/etchback system designed to efficiently remove sensitized resinous material from the hole wall of printed circuit boards. MAGNUM N-501 OXIDIZER produces a microporous surface topography to improve catalyst absorption and hole wall adhesion of electroless copper. Using MAGNUM N-501 OXIDIZER, positive etchback can be obtained with three-point connection of the inner layer in most resin systems.
A neutralizer for oxidizer residue left on the hole wall following the permanganate desmear/etchback process. MAGNUM N-599 is used following treatment with MAGNUM K-OXIDIXER or MAGNUM N-OXIDIZER. MAGNUM GE-600 glass etch can be added to the solution to etch back the protruding glass bundles.
The first part of a three step process for multilayer hole preparation. MAGNUM S-400 is used to prepare resinous substrates for subsequent oxidation by permanganate. When used in conjunction with MAGNUM K-OXIDIZER or MAGNUM N-OXIDIZER, it penetrates resin smear for effective desmear and etchback. It is equally effective on epoxy and polyimide resin systems. The solution is replenishable and the boards need not be dried prior to processing.
MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide. It is replenishable and does not require circuit boards to be dried prior to processing. Use in conjunction with MAGNUM K-OXIDIZER or MAGNUM N-OXIDIZER for desmear and etchback.
Onyx is a process in which a proprietary graphite dispersion is used to impart electrical conductivity on through holes and vias of printed circuit boards. This process prepares the board for copper electroplating in a similar way electroless copper process does but with the benefits of simplicity and environmental friendliness. Onyx consists of a short sequence of chemical steps that include conditioning with Onyx CC, graphite application with Onyx DM and leveling with Onyx LV.