Organic Solderability Preservative Final Finish for Printed Circuit Boards
Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface mount technology. It can be used for mixed final finish, ENIG/OSP applications.
Aspect is supplied in three concentrated components, two for bath make-up and an additional component for non-regular replenishment. It contains a substituted imidazole, acetic acid and is Cu-free. Treated Cu surfaces are covered with a thin (0.2 – 0.4 micron), nearly colorless and transparent coating.
Aspect is used in a standard immersion line incorporating the chemical steps of Cleaner, Microetch, and OSP with counterflow rinses in between. Rinsing and drying between each step will prevent variations in coating thickness. It is recommended to use an acidic cleaner appropriate for a final finish, such as FinClean CR or FinClean RS from RBP, as well as a peroxide-based microetch as this chemistry creates a better surface topography for coating formation. Peroxide microetch chemistry is also more easily rinsed.
An example of such microetch is Quantum Etch from RBP. Aspect bath make-up instructions are provided in the data sheets below.
An acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic contaminants. NC ACID CLEANER removes soils such as fingerprints, oxides and chromate conversion coating prior to photoresist lamination, oxide treatment, and multilayer lamination to improve adhesion. It is compatible with photoresists making it effective for pattern plate cleaning. Its non-chelating formula cleans and conditions copper surfaces and can be followed by a microetch for optimum performance. It is effective in both spray and soak applications.
MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing the topography of the copper substrate. MAGNABOND OxAlt offers several benefits over other conventional oxide and competitive oxide alternatives, including: low cost of operation; ease of control, and consistent copper topography at etch rates of 40 microinches per minute. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the MAGNABOND OxAlt.
MicroClean CuLX is a micro-cleaner” that is designed to remove extremely tenacious soils from copper