Organic Solderability Preservative Final Finish for Printed Circuit Boards
Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface mount technology. It can be used for mixed final finish, ENIG/OSP applications.
Aspect is supplied in three concentrated components, two for bath make-up and an additional component for non-regular replenishment. It contains a substituted imidazole, acetic acid and is Cu-free. Treated Cu surfaces are covered with a thin (0.2 – 0.4 micron), nearly colorless and transparent coating.
Aspect is used in a standard immersion line incorporating the chemical steps of Cleaner, Microetch, and OSP with counterflow rinses in between. Rinsing and drying between each step will prevent variations in coating thickness. It is recommended to use an acidic cleaner appropriate for a final finish, such as FinClean CR or FinClean RS from RBP, as well as a peroxide-based microetch as this chemistry creates a better surface topography for coating formation. Peroxide microetch chemistry is also more easily rinsed.
An example of such microetch is Quantum Etch from RBP. Aspect bath make-up instructions are provided in the data sheets below.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.