Organic Solderability Preservative Final Finish for Printed Circuit Boards
Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface mount technology. It can be used for mixed final finish, ENIG/OSP applications.
Aspect is supplied in three concentrated components, two for bath make-up and an additional component for non-regular replenishment. It contains a substituted imidazole, acetic acid and is Cu-free. Treated Cu surfaces are covered with a thin (0.2 – 0.4 micron), nearly colorless and transparent coating.
Aspect is used in a standard immersion line incorporating the chemical steps of Cleaner, Microetch, and OSP with counterflow rinses in between. Rinsing and drying between each step will prevent variations in coating thickness. It is recommended to use an acidic cleaner appropriate for a final finish, such as FinClean CR or FinClean RS from RBP, as well as a peroxide-based microetch as this chemistry creates a better surface topography for coating formation. Peroxide microetch chemistry is also more easily rinsed.
An example of such microetch is Quantum Etch from RBP. Aspect bath make-up instructions are provided in the data sheets below.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
CuPolish Cleaner is a patented cleaner/microetch/adhesion promoter for use on copper. It will give optimal adhesion, both initially and during subsequent processing, where other process chemicals can weaken the bond at the copper interface. CuPolish Cleaner gives an atypical looking surface appearance. The surface after cleaning is bright orange, rather than the more typical matte pink obtained when using other cleaners. Furthermore, after rinsing, the panel will exhibit a water-break that makes it look “worse” than before cleaning. This phenomenon is caused by an adhesion promoter and is normal for this product