Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit SN Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries.
A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF 30 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
ChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex material and rigid laminate prior to resist lamination. It removes oxidation, light organic soil and the chromate conversion coating. ChemBond 300 forms a surface treatment that resists tarnishing and enhances Resist Stripper, eliminating resist lockon. It will not act as a microetch.