An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN M is formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior to oxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN M can be followed by a microetch when necessary for increased adhesion.
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.