Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777 is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid. CIRCUTEK PD-776S is also used in the preparation of CIRCUTEK C-777.