A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
ChemBrite is a powerful organic solder and tin deoxidizer and brightener. The organic acids in ChemBrite, combined with other coordinating compounds, give optimum deoxidizing. They are especially important in conditioning printed circuit boards (PCB’s) where the copper etch used is unusually aggressive (which results in a tough oxide film on the solder), or when the solder conditioning time is quite short. Oxides remaining on circuit boards result in a white haze after the board is fused.
ChemBrite is not as corrosive as solder conditioners based on mineral acids, like HCl or HF; this allows a longer lag time between etching and fusing with minimal white haze buildup.
ChemBrite has also been used to clean up tin plating in the lead frame industry, prior to gold plating.
An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710 is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC710 is supplied as a liquid concentrate.
A blended organic defoaming surfactant for use in reducing foam generated in spray equipment. ANTIFOAM BB is especially effective in solutions used for developing and stripping aqueous and semi-aqueous dry film photoresists. Effective at low temperatures of 80?-130? F.