Products

 

CIRCUTEK™ EC-1050

A room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. CIRCUTEK EC-1050 is easy to control, and has a broad range of operating temperature and bath loading tolerance. The copper produced is a bright pink, fine-grained deposit which is readily receptive to subsequent copper electrodeposition.

Download Data Sheets

Download Data Sheets :