A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
A one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC 47 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 47 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used.
A room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. CIRCUTEK EC-1050 is easy to control, and has a broad range of operating temperature and bath loading tolerance. The copper produced is a bright pink, fine-grained deposit which is readily receptive to subsequent copper electrodeposition.