A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit SN Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit SN may be replenished to maintain key ingredients.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.