A high speed, electroless copper process which is capable of depositing 80 – 100 millionths
of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on
catalyzed surfaces for the production of printed circuit boards.

The solution is easy to control and has a broad operating temperature range. The copper
produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent
copper electrodeposition.

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