An additive containing the carrier component of the brightener system for CuBrite PC-
525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
excessive additions of brightener to maintain desired characteristics of the plated copper
deposit. It can be used after carbon treatment of the plating bath, or whenever there is
excessive drag-out of the plating solution.
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777 is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid. CIRCUTEK PD-776S is also used in the preparation of CIRCUTEK C-777.
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF 25 breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF 25 demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF 72 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life