An additive containing the carrier component of the brightener system for CuBrite PC-
525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
excessive additions of brightener to maintain desired characteristics of the plated copper
deposit. It can be used after carbon treatment of the plating bath, or whenever there is
excessive drag-out of the plating solution.
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 40 also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF 25 breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF 25 demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.