An additive containing the carrier component of the brightener system for CuBrite PC-
525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
excessive additions of brightener to maintain desired characteristics of the plated copper
deposit. It can be used after carbon treatment of the plating bath, or whenever there is
excessive drag-out of the plating solution.
A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF 25C breaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF 25C demonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO is formulated to be compatible with THERMO FLO® and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hardto-fuse areas and is non-foaming.