An additive containing the carrier component of the brightener system for CuBrite PC-
525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
excessive additions of brightener to maintain desired characteristics of the plated copper
deposit. It can be used after carbon treatment of the plating bath, or whenever there is
excessive drag-out of the plating solution.
Ferric Chloride Solution is acidic and should be handled only with appropriate safety equipment including goggles, gloves and protective clothing. Follow standard laboratory practices. Consult Safety Data Sheet for further information. Used solutions contain metal ions and may require treatment before spent solutions are disposed. Dispose of in accordance with federal, state and local regulations. Contact your RBP representative for further information.Clear to slightly hazy, dark red-brown liquid with a sharp odor.
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”