SKU: N9130 Categories: , ,

A matte acid copper plating additive formulated for plating baths with high throwing power resulting in excellent surface to hole thickness ratios in through-hole plating of printed circuit boards. Based on economical copper sulfate and sulfuric acid, it is easy to make up, operate and control. CuBrite CF-110 is a single grain refining agent that is added on an ampere hour basis and is not removed by circulation of the plating solution through a filter packed with carbon. The addition agent reaction products and organic contamination can thus be removed on a continuous basis to assure excellent deposit ductility. CuBrite CF-110 produces finegrained, soft, matte deposits that insure good solderability, resist adhesion and etch characteristics.

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