A matte acid copper plating additive formulated for plating baths with high throwing power resulting in excellent surface to hole thickness ratios in through-hole plating of printed circuit boards. Based on economical copper sulfate and sulfuric acid, it is easy to make up, operate and control. CuBrite CF-110 is a single grain refining agent that is added on an ampere hour basis and is not removed by circulation of the plating solution through a filter packed with carbon. The addition agent reaction products and organic contamination can thus be removed on a continuous basis to assure excellent deposit ductility. CuBrite CF-110 produces finegrained, soft, matte deposits that insure good solderability, resist adhesion and etch characteristics.
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778 produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777 is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid. CIRCUTEK PD-776S is also used in the preparation of CIRCUTEK C-777.
ChemBrite is a powerful organic solder and tin deoxidizer and brightener. The organic acids in ChemBrite, combined with other coordinating compounds, give optimum deoxidizing. They are especially important in conditioning printed circuit boards (PCB’s) where the copper etch used is unusually aggressive (which results in a tough oxide film on the solder), or when the solder conditioning time is quite short. Oxides remaining on circuit boards result in a white haze after the board is fused.
ChemBrite is not as corrosive as solder conditioners based on mineral acids, like HCl or HF; this allows a longer lag time between etching and fusing with minimal white haze buildup.
ChemBrite has also been used to clean up tin plating in the lead frame industry, prior to gold plating.