A matte acid copper plating additive formulated for plating baths with high throwing power resulting in excellent surface to hole thickness ratios in through-hole plating of printed circuit boards. Based on economical copper sulfate and sulfuric acid, it is easy to make up, operate and control. CuBrite CF-110 is a single grain refining agent that is added on an ampere hour basis and is not removed by circulation of the plating solution through a filter packed with carbon. The addition agent reaction products and organic contamination can thus be removed on a continuous basis to assure excellent deposit ductility. CuBrite CF-110 produces finegrained, soft, matte deposits that insure good solderability, resist adhesion and etch characteristics.
A mildly activated flux for use prior to hot oil fusing. 291 FLUX is formulated without isopropyl alcohol, making it safer to use and store. It is compatible with THERMO FLO® and PRO FUSE Fusing / Leveling fluids. 291 FLUX contains ingredients used in the fusing fluids, which results in reduced consumption and prolongs the life of the fusing fluids.
BOARD BRITE II is an acid cleaner for cleaning and conditioning tin/lead plated board surfaces. It neutralizes ammonia salt residues from alkaline etchants and removes oxides formed during storage. BOARD BRITE II can be used as a pre-cleaner prior to fusing to enhance fusing characteristics. It is effective in both spray and soak applications.
Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF 10 BAT will generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF 10 BAT contains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.