A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
A one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC 47 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 47 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used.
ChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex material and rigid laminate prior to resist lamination. It removes oxidation, light organic soil and the chromate conversion coating. ChemBond 300 forms a surface treatment that resists tarnishing and enhances Resist Stripper, eliminating resist lockon. It will not act as a microetch.
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO is formulated to be compatible with THERMO FLO® and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hardto-fuse areas and is non-foaming.