A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.
A mildly activated flux for use prior to hot oil fusing. 291 FLUX is formulated without isopropyl alcohol, making it safer to use and store. It is compatible with THERMO FLO® and PRO FUSE Fusing / Leveling fluids. 291 FLUX contains ingredients used in the fusing fluids, which results in reduced consumption and prolongs the life of the fusing fluids.
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF 30 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.