A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO is formulated to be compatible with THERMO FLO® and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hardto-fuse areas and is non-foaming.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.