Layer Clean™ NP
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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Accuclean NF
A non-foaming, acidic cleaner formulated to remove oxide and tarnish from copper surfaces.ACCUCLEAN™NFis sprayable at room temperature and has a very low copper etch rate. It can be used in conveyorized applications for cleaning copper prior to solder mask application, as an activator in automatic tab plating machines, or wherever a sprayable copper cleaner is needed. ACCUCLEAN™NFis supplied in concentrated form.
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De-Ox™ II
De-Ox II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox II does not attack plastic surfaces in test sockets.
