Formulated to provide the ultimate in speed for automated tab plating machines while
maintaining excellent capacity. M-STRIP will remove 0.5 mil of unfused tin/lead within 20
seconds in spray application.
A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
A one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC 47 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 47 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used.
Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit SN Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit SN may be replenished to maintain key ingredients.