Formulated to provide the ultimate in speed for automated tab plating machines while
maintaining excellent capacity. M-STRIP will remove 0.5 mil of unfused tin/lead within 20
seconds in spray application.
A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF 25C breaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF 25C demonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.
A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.