Formulated to provide the ultimate in speed for automated tab plating machines while
maintaining excellent capacity. M-STRIP will remove 0.5 mil of unfused tin/lead within 20
seconds in spray application.
ChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex material and rigid laminate prior to resist lamination. It removes oxidation, light organic soil and the chromate conversion coating. ChemBond 300 forms a surface treatment that resists tarnishing and enhances Resist Stripper, eliminating resist lockon. It will not act as a microetch.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.
Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF 10 BAT will generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF 10 BAT contains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.