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MAGNUM™ N-501 OXIDIZER

A sodium permanganate based desmear/etchback system designed to efficiently remove sensitized resinous material from the hole wall of printed circuit boards. MAGNUM N-501 OXIDIZER produces a microporous surface topography to improve catalyst absorption and hole wall adhesion of electroless copper. Using MAGNUM N-501 OXIDIZER, positive etchback can be obtained with three-point connection of the inner layer in most resin systems.

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