An acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic contaminants. NC ACID CLEANER removes soils such as fingerprints, oxides and chromate conversion coating prior to photoresist lamination, oxide treatment, and multilayer lamination to improve adhesion. It is compatible with photoresists making it effective for pattern plate cleaning. Its non-chelating formula cleans and conditions copper surfaces and can be followed by a microetch for optimum performance. It is effective in both spray and soak applications.
ChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex material and rigid laminate prior to resist lamination. It removes oxidation, light organic soil and the chromate conversion coating. ChemBond 300 forms a surface treatment that resists tarnishing and enhances Resist Stripper, eliminating resist lockon. It will not act as a microetch.