MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing the topography of the copper substrate. MAGNABOND OxAlt offers several benefits over other conventional oxide and competitive oxide alternatives, including: low cost of operation; ease of control, and consistent copper topography at etch rates of 40 microinches per minute. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the MAGNABOND OxAlt.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
An acidic blend of surfactants used as an acid soak conditioner to prepare copper surfaces
for plating.VersaCLEAN 425 removes metal oxides, light oils and other organic
contaminants. VersaCLEAN 425 contains no chelating agents which would make waste
treatment difficult. VersaCLEAN 425 can be followed by a microetch to achieve increased
adhesion when needed.