An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
An acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic contaminants. NC ACID CLEANER removes soils such as fingerprints, oxides and chromate conversion coating prior to photoresist lamination, oxide treatment, and multilayer lamination to improve adhesion. It is compatible with photoresists making it effective for pattern plate cleaning. Its non-chelating formula cleans and conditions copper surfaces and can be followed by a microetch for optimum performance. It is effective in both spray and soak applications.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.