For use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of the panels at a steady rate, preventing thermal shock and maintaining a bright, even solder appearance. It is non-foaming and rinses easily with water.
A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF 72 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life
Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit SN Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit SN may be replenished to maintain key ingredients.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.