For use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of the panels at a steady rate, preventing thermal shock and maintaining a bright, even solder appearance. It is non-foaming and rinses easily with water.
Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit SN Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit SN may be replenished to maintain key ingredients.
A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF 25C breaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF 25C demonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.