A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF 25C breaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF 25C demonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.
A one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC 47 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 47 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used.
A room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. CIRCUTEK EC-1050 is easy to control, and has a broad range of operating temperature and bath loading tolerance. The copper produced is a bright pink, fine-grained deposit which is readily receptive to subsequent copper electrodeposition.