A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF 30 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778 produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO is formulated to be compatible with THERMO FLO® and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hardto-fuse areas and is non-foaming.