ResiStrip MND is designed to completely remove LDI photoresist from Copper and
Copper based substrates. LDI forms powerful chemical bonds to substrate Copper, and
requires a formula designed to break these bonds. ResiStrip MND is specifically
formulated to remove photoresist particles that have become lodged in tight mil spaces.
Removing these particles with conventional photoResist Stripper systems is difficult and
nearly impossible. ResiStrip MND can be used following less expensive stripping
systems that remove the bulk of the photoresist, without rinsing between strippers.
ResiStrip MND will leave Copper in a bright, tarnish-free condition.