ResiStrip VMND is designed to completely remove LDI photoresist from Copper and
Copper based substrates. LDI forms powerful chemical bonds to substrate Copper, and
requires a formula designed to break these bonds. ResiStrip VMND is specifically
formulated to remove photoresist particles that have become lodged in tight mil spaces.
Removing these particles with conventional photoResist Stripper systems is difficult and
nearly impossible. Replenishing ResiStrip VMND can be done using a special additive,
ResiStrip Maintain (RDZ-2066), instead of the start-up stripper, which cuts
replenishment costs dramatically, and maintains full stripping performance. ResiStrip
VMND leaves Copper in a bright, tarnish-free condition.