An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778 produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF 25C breaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF 25C demonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.
An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.