A chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, where a lower viscosity flux is desired for complete wetting of small holes and surface mount pads. FLO RITE LV provides excellent wetting and even coverage, resulting in a superior solder finish.
FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 NH contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These same ingredients help keep the equipment clean