ChemBond 300 is a single step, acidic cleaner and adhesion promoter for inner layers, flex material and rigid laminate prior to resist lamination. It removes oxidation, light organic soil and the chromate conversion coating. ChemBond 300 forms a surface treatment that resists tarnishing and enhances Resist Stripper, eliminating resist lockon. It will not act as a microetch.
A one-part concentrate (47% potassium carbonate) formulated to develop fully aqueous dry film photoresists. ADC 47 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 47 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used.
A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.