A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF 25 breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF 25 demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 45N also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.