Chemposit SN plates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit SN deposits remain solderable for extended periods, (to 6 months) and will not “Tin Whisker”. Chemposit SN Immersion Tin plating baths operate more easily and are poisoned” less readily than other Immersion Tin plating chemistries. Chemposit SN may be replenished to maintain key ingredients.
BOARD BRITE II is an acid cleaner for cleaning and conditioning tin/lead plated board surfaces. It neutralizes ammonia salt residues from alkaline etchants and removes oxides formed during storage. BOARD BRITE II can be used as a pre-cleaner prior to fusing to enhance fusing characteristics. It is effective in both spray and soak applications.
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778 produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.