A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF 72 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life
Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF 10 BAT will generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF 10 BAT contains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.
A high speed, electroless copper process which is capable of depositing 80 – 100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards. The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.