Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the copper. ULTRACLEAN NF is especially recommended for cleaning Invar/copper laminate and double treated copper foil. Also for use prior to resist lamination, oxide treatment and plating processes. Its non-chelating formula allows for easy waste treatment. ULTRACLEAN NF is non-foaming for use in conveyorized spray applications.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
An acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic contaminants. NC ACID CLEANER removes soils such as fingerprints, oxides and chromate conversion coating prior to photoresist lamination, oxide treatment, and multilayer lamination to improve adhesion. It is compatible with photoresists making it effective for pattern plate cleaning. Its non-chelating formula cleans and conditions copper surfaces and can be followed by a microetch for optimum performance. It is effective in both spray and soak applications.