Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
ResiStrip VI is designed to address the chemical milling industry’s requirements for a fast and cost effective stripper for Copper, Alloy 42, and stainless steel. ResiStrip VI strips thoroughly and quickly, while costing a fraction of conventional proprietary stripping systems. ResiStrip VI leaves copper in a bright, tarnish free condition and will remove any staining of stainless steel from the photoresist. ResiStrip VI gives a small stripped particle size.
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