An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710 is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC710 is supplied as a liquid concentrate.
Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF-10 BAT will generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF-10 BAT contains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.
A blended organic defoaming surfactant for use in reducing foam generated in spray equipment. ANTIFOAM BB is especially effective in solutions used for developing and stripping aqueous and semi-aqueous dry film photoresists. Effective at low temperatures of 80?-130? F.