A concentrated alkaline equipment cleaner designed to clean conveyorized processing equipment. TIDYLINE EQ-100 effectively removes such process foulants as dry film photoresist scum and stains, etchant residue, and hard water scale.
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLO is formulated to be compatible with THERMO FLO® and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hardto-fuse areas and is non-foaming.
A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF 72 provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777 is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid. CIRCUTEK PD-776S is also used in the preparation of CIRCUTEK C-777.