TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating of tin in
the application for SMOBC fabrication. TinPlate PC-625 is formulated to improve the
throwing power of the bath, aid in refining grain structure, and prevent treeing. It is added
based on amp hours and will increase limiting current density and control deposit
characteristics over a wide range of current densities. It produces a bright silver white
deposit. TinPlate PC-625 eliminates the need for lead and fluoborates used in
conventional etch resist plating processes. If an extra wetting agent is needed,
use TinPlate PC-625 Starter. Please consult your service representative for additions.
An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.
A new colloidal catalyst designed to activated no-conductive substrates such as epoxyglass, ceramics and other plastics. CIRCUTEK CU-825 will catalyze printed circuit boards for electroless through hole plating.
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778 produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.