TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating of tin in
the application for SMOBC fabrication. TinPlate PC-625 is formulated to improve the
throwing power of the bath, aid in refining grain structure, and prevent treeing. It is added
based on amp hours and will increase limiting current density and control deposit
characteristics over a wide range of current densities. It produces a bright silver white
deposit. TinPlate PC-625 eliminates the need for lead and fluoborates used in
conventional etch resist plating processes. If an extra wetting agent is needed,
use TinPlate PC-625 Starter. Please consult your service representative for additions.
FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 NH contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These same ingredients help keep the equipment clean