VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, imaging and solder mask application. Microetching results in surfaces that are cleaner, with removed or reduced oxide and with higher roughness. These mechanisms occur to a different extent on different metals. VersaPrep is effective on aluminum, stainless steel, copper, copper alloys and selected other alloys such as Inconel. Different substrates can be treated with simple adjustments of concentration, temperature and contact time. VersaPrep can be used in either spray or soak mode.
An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch. It completely removes residues from Resist Stripper, and is extremely effective for removing handling soils and fingerprints. For spray, flood and soak applications.
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN M is formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior to oxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN M can be followed by a microetch when necessary for increased adhesion.
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.