VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, imaging and solder mask application. Microetching results in surfaces that are cleaner, with removed or reduced oxide and with higher roughness. These mechanisms occur to a different extent on different metals. VersaPrep is effective on aluminum, stainless steel, copper, copper alloys and selected other alloys such as Inconel. Different substrates can be treated with simple adjustments of concentration, temperature and contact time. VersaPrep can be used in either spray or soak mode.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
CuPolish Cleaner is a patented cleaner/microetch/adhesion promoter for use on copper. It will give optimal adhesion, both initially and during subsequent processing, where other process chemicals can weaken the bond at the copper interface. CuPolish Cleaner gives an atypical looking surface appearance. The surface after cleaning is bright orange, rather than the more typical matte pink obtained when using other cleaners. Furthermore, after rinsing, the panel will exhibit a water-break that makes it look “worse” than before cleaning. This phenomenon is caused by an adhesion promoter and is normal for this product