RBP Chemical Technology has launched a webcast series on Troubleshooting Printed Wiring Board Defects focused on improving the PCB fabrication process.
Led by Mike Carano, RBP Vice President Technology and Business Development, this webcast series will address advanced problem solving of printed circuit board defects. Attendees should have some knowledge of the printed circuit board fabrication process.
Get to know Mike Carano on LinkedIn.
This webcast series will explore the most intricate of these factors and how the interrelationship of both up and downstream processes contribute to scrap product. Defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent and multiple factors may contribute.
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Access the Webcast Series with Mike Carano:
Join us for a single session or all three. Topics vary but cover the themes listed below.
Jan 30, 2018 11:00 AM (CST)
- Proper desmear parameters
- Working with high Tg and high Td materials
- Preparing flexible circuit materials
- Optimization of PTH process to insure void free deposit
- Discussion of various defects attributed to PTH process
- Holewall pullaway
- Interconnect defect
- Plating folds
- Negative etchback